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參數(shù)資料
| 型號： | TISP7350F3P-S |
| 廠商： | BOURNS INC |
| 元件分類： | 浪涌電流限制器 |
| 英文描述： | 350 V, 5.7 A, SILICON SURGE PROTECTOR, MS-001BA |
| 封裝： | LEAD FREE, PLASTIC, D008, MS-001, DIP-8 |
| 文件頁數(shù)： | 15/23頁 |
| 文件大小： | 509K |
| 代理商： | TISP7350F3P-S |
MARCH 1994 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MECHANICAL DATA
D008 Plastic Dual-in-Line Package
P008
3
12
4
87
6
5
Seating
Plane
NOTES: A. Each pin centerline is located within 0.25 (0.010) of its true longitudinal position.
B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.
MDXXCF
Index
Notch
9.25 - 9.75
(0.364 - 0.384)
6.10 - 6.60
(0.240 - 0.260)
5.08
(0.200)
1.78
(0.070)
MAX.
4 Places
8 Places
MAX.
3.17
(0.125)
MIN.
0.51
(0.020)
MIN.
2.54
(0.100)
Typical
(see Note A)
6 Places
0.38 - 0.53
(0.015 - 0.021)
7.62 - 8.23
(0.300 - 0.324)
8.38 - 9.40
(0.330 - 0.370)
0.20 - 0.36
(0.008 - 0.014)
DIMENSIONS ARE:
METRIC
(INCHES)
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. The package is intended for insertion in mounting-hole rows on 7.62 (0.300) centers. Once the leads are compressed and
inserted, sufficient tension is provided to secure the package in the board during soldering. Leads require no additional cleaning or processing
when used in soldered assembly.
TISP7xxxF3 (MV, HV) Overvoltage Protector Series
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TISP7350F3SL | 功能描述:硅對稱二端開關(guān)元件 275V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7350F3SL-S | 功能描述:硅對稱二端開關(guān)元件 275V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7350H3SL | 功能描述:硅對稱二端開關(guān)元件 Triple Element Bidirectional RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7350H3SL-S | 功能描述:硅對稱二端開關(guān)元件 Triple Element Bidirectional RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP73580H3SL | 功能描述:硅對稱二端開關(guān)元件 275V 600mA RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
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