參數(shù)資料
型號(hào)： TISP7350F3
廠商： Power Innovations International, Inc.
英文描述： Push-pull coupling, HRS unique design, Small and lightweight interface; HRS No: 110-0058-6 00; Shell Size (dia): 7; Operating Temperature Range (degrees C): -25 to 85; General Description: Accessory; Dust cap
中文描述： 三重雙向可控硅過(guò)電壓保護(hù)器
文件頁(yè)數(shù)： 24/25頁(yè)
文件大?。?/td> 489K
代理商： TISP7350F3
TISP7125F3,TISP7150F3,TISP7180F3,TISP7240F3,TISP7260F3,
TISP7290F3,TISP7320F3,TISP7350F3,TISP7380F3
TRIPLEBIDIRECTIONALTHYRISTOROVERVOLTAGEPROTECTORS
MARCH 1994 - REVISED MARCH 2000
24
P R O D U C T I N F O R M A T I O N
MECHANICAL DATA
SL003
3-pin plastic single-in-line package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES
2,54 (0.100) Typical
(see Note A)
2 Places
8,31 (0.327)
MAX
SL003
4,267 (0.168)
MIN
1,854 (0.073)
MAX
0,711 (0.028)
0,559 (0.022)
3 Places
12,9 (0.492)
MAX
6,60 (0.260)
6,10 (0.240)
2
1
3
0,356 (0.014)
0,203 (0.008)
3,40 (0.134)
3,20 (0.126)
9,75 (0.384)
9,25 (0.364)
NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.
B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.
C. Details of the previous dot index SL003 style, drawing reference MDXXAD, are given in the earlier publications.
MDXXCE
Index
Notch
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TISP7350F3D 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:MEDIUM & HIGH-VOLTAGE TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
TISP7350F3DR 功能描述:硅對(duì)稱二端開(kāi)關(guān)元件 RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開(kāi)啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
TISP7350F3DR-S 功能描述:硅對(duì)稱二端開(kāi)關(guān)元件 BI-DIRECTIONL PRTCTR 275volts RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開(kāi)啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
TISP7350F3D-S 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:MEDIUM & HIGH-VOLTAGE TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
TISP7350F3SL 功能描述:硅對(duì)稱二端開(kāi)關(guān)元件 275V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開(kāi)啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
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