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參數(shù)資料
| 型號： | TISP7082F3SL |
| 廠商： | Power Innovations International, Inc. |
| 英文描述： | TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| 中文描述： | 三重雙向可控硅過電壓保護(hù)器 |
| 文件頁數(shù)： | 20/22頁 |
| 文件大?。?/td> | 400K |
| 代理商： | TISP7082F3SL |
TISP7072F3,TISP7082F3
TRIPLEBIDIRECTIONALTHYRISTOROVERVOLTAGEPROTECTORS
MARCH 1994 - REVISED MARCH 2000
20
P R O D U C T I N F O R M A T I O N
MECHANICAL DATA
P008
plastic dual-in-line package
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions The package is intended for
insertion in mounting-hole rows on 7,62 (0.300) centres. Once the leads are compressed and inserted,
sufficient tension is provided to secure the package in the board during soldering. Leads require no additional
cleaning or processing when used in soldered assembly.
ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES
0,53 (0.021)
0,38 (0.015)
8 Places
1,78 (0.070) MAX
4 Places
6,60 (0.260)
6,10 (0.240)
P008
8,23 (0.324)
7,62 (0.300)
9,75 (0.384)
9,25 (0.364)
2,54 (0.100) Typical
(see Note A)
6 Places
5,08 (0.200)
MAX
3,17 (0.125)
MIN
0,51 (0.020)
MIN
3
1
2
4
8
7
6
5
Seating
Plane
9,40 (0.370)
8,38 (0.330)
0,36 (0.014)
0,20 (0.008)
NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.
B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.
C. Details of the previous dot index P008 package style, drawing reference MDXXABA, are given in the earlier publications.
MDXXCF
Index
Notch
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TISP7082F3SLS | 制造商:Bourns Inc 功能描述: |
| TISP7082F3SL-S | 功能描述:硅對稱二端開關(guān)元件 Low Volt Triple Elmt Bidirectional RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7095H3SL | 功能描述:硅對稱二端開關(guān)元件 RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7095H3SL-S | 功能描述:硅對稱二端開關(guān)元件 RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP70XXF3 | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:LOW-VOLTAGE TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
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