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參數(shù)資料
| 型號： | TISP7082F3P |
| 廠商： | Power Innovations International, Inc. |
| 英文描述： | TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| 中文描述： | 三重雙向可控硅過電壓保護器 |
| 文件頁數(shù)： | 18/22頁 |
| 文件大?。?/td> | 400K |
| 代理商： | TISP7082F3P |
TISP7072F3,TISP7082F3
TRIPLEBIDIRECTIONALTHYRISTOROVERVOLTAGEPROTECTORS
MARCH 1994 - REVISED MARCH 2000
18
P R O D U C T I N F O R M A T I O N
MECHANICAL DATA
D008
plastic small-outline package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
5,21 (0.205)
4,60 (0.181)
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
1,75 (0.069)
1,35 (0.053)
6,20 (0.244)
5,80 (0.228)
5,00 (0.197)
4,80 (0.189)
D008
8
7
6
5
4
3
2
1
4,00 (0.157)
3,81 (0.150)
7° NOM
3 Places
7° NOM
4 Places
0,51 (0.020)
0,36 (0.014)
8 Places
Pin Spacing
1,27 (0.050)
(see Note A)
6 Places
1,12 (0.044)
0,51 (0.020)
4° ± 4°
0,79 (0.031)
0,28 (0.011)
0,203 (0.008)
0,102 (0.004)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
0,50 (0.020)
0,229 (0.0090)
0,190 (0.0075)
MDXXAAC
INDEX
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PDF描述 |
|---|---|
| TISP7082F3SL | TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| TISP7125F3 | TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| TISP7380F3 | TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| TISP7180F3SL | TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| TISP7125F3D | TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TISP7082F3PS | 制造商:Bourns Inc 功能描述: |
| TISP7082F3P-S | 功能描述:硅對稱二端開關元件 Low Volt Triple Elmt Bidirectional RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7082F3SL | 功能描述:硅對稱二端開關元件 Low Volt Triple Elmt Bidirectional RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7082F3SLS | 制造商:Bourns Inc 功能描述: |
| TISP7082F3SL-S | 功能描述:硅對稱二端開關元件 Low Volt Triple Elmt Bidirectional RoHS:否 制造商:Bourns 轉折電流 VBO:40 V 最大轉折電流 IBO:800 mA 不重復通態(tài)電流: 額定重復關閉狀態(tài)電壓 VDRM:25 V 關閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風格:SMD/SMT 封裝 / 箱體:DO-214AA |
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