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| 型號(hào)： | TIC266N |
| 廠商： | Power Innovations International, Inc. |
| 英文描述： | SILICON TRIACS |
| 中文描述： | 硅雙向可控硅 |
| 文件頁(yè)數(shù)： | 1/5頁(yè) |
| 文件大小： | 99K |
| 代理商： | TIC266N |
TIC266 SERIES
SILICON TRIACS
P R O D U C T I N F O R M A T I O N
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
JULY 1991 - REVISED MARCH 1997
Copyright 1997, Power Innovations Limited, UK
G
High Current Triacs
G
25 A RMS
G
Glass Passivated Wafer
G
400 V to 800 V Off-State Voltage
G
175 A Peak Current
G
Max I
GT
of 50 mA (Quadrants 1 - 3)
MT1
MT2
G
TO-220 PACKAGE
(TOP VIEW)
Pin 2 is in electrical contact with the mounting base.
MDC2ACA
1
2
3
absolute maximum ratings
over operating case temperature (unless otherwise noted)
RATING
NOTES: 1. These values apply bidirectionally for any value of resistance between the gate and Main Terminal 1.
2. This value applies for 50-Hz full-sine-wave operation with resistive load. Above 50°C derate linearly to 110°C case temperature at
the rate of 625 mA/°C.
3. This value applies for one 50-Hz full-sine-wave when the device is operating at (or below) the rated value of peak reverse voltage
and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium.
SYMBOL
VALUE
400
600
700
800
25
175
±1
-40 to +110
-40 to +125
230
UNIT
Repetitive peak off-state voltage (see Note 1)
TIC266D
TIC266M
TIC266S
TIC266N
V
DRM
V
Full-cycle RMS on-state current at (or below) 50°C case temperature (see Note 2)
Peak on-state surge current full-sine-wave (see Note 3)
Peak gate current
Operating case temperature range
Storage temperature range
Lead temperature 1.6 mm from case for 10 seconds
I
T(RMS)
I
TSM
I
GM
T
C
T
stg
T
L
A
A
A
°C
°C
°C
electrical characteristics at 25°C case temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
I
DRM
Repetitive peak
off-state current
V
D
= Rated V
DRM
I
G
= 0
T
C
= 110°C
±2
mA
I
GTM
Peak gate trigger
current
V
supply
= +12 V
V
supply
= +12 V
V
supply
= -12 V
V
supply
= -12 V
V
supply
= +12 V
V
supply
= +12 V
V
supply
= -12 V
V
supply
= -12 V
I
TM
= ±35.2 A
V
supply
= +12 V
V
supply
= -12 V
R
L
= 10
R
L
= 10
R
L
= 10
R
L
= 10
R
L
= 10
R
L
= 10
R
L
= 10
R
L
= 10
I
G
= 50 mA
I
G
= 0
I
G
= 0
t
p(g)
> 20
μ
s
t
p(g)
> 20
μ
s
t
p(g)
> 20
μ
s
t
p(g)
> 20
μ
s
t
p(g)
> 20
μ
s
t
p(g)
> 20
μ
s
t
p(g)
> 20
μ
s
t
p(g)
> 20
μ
s
(see Note 4)
Init’ I
TM
= 100 mA
Init’ I
TM
= -100 mA
7
-15
-16
28
0.7
-0.7
-0.8
0.8
±1.5
6
-13
50
-50
-50
mA
V
GTM
Peak gate trigger
voltage
2
-2
-2
2
V
V
TM
Peak on-state voltage
±1.7
40
-40
V
I
H
Holding current
mA
All voltages are with respect to Main Terminal 1.
NOTE
4: This parameter must be measured using pulse techniques, t
p
=
≤
1 ms, duty cycle
≤
2 %. Voltage-sensing contacts separate from
the current carrying contacts are located within 3.2 mm from the device body.
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