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參數(shù)資料
| 型號： | TIBPAL16L8 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| 中文描述： | 高性能影響組E PAL制式電路 |
| 文件頁數(shù)： | 22/23頁 |
| 文件大小： | 234K |
| 代理商： | TIBPAL16L8 |
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
Addendum-Page 2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TIBPAL16L8-12MFK | HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| TIBPAL16R6-10CJ | HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| TIBPAL16R4-10CJ | HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| TIBPAL16L8-10MFK | HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| TIBPAL16R8-10MFK | HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TIBPAL16L8-10 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| TIBPAL16L8-10C | 制造商:TI 制造商全稱:Texas Instruments 功能描述:HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| TIBPAL16L8-10CFN | 功能描述:SPLD - 簡單可編程邏輯器件 High-Performance Impact-X PAL Circuit RoHS:否 制造商:Texas Instruments 邏輯系列:TICPAL22V10Z 大電池數(shù)量:10 最大工作頻率:66 MHz 延遲時間:25 ns 工作電源電壓:4.75 V to 5.25 V 電源電流:100 uA 最大工作溫度:+ 75 C 最小工作溫度:0 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:DIP-24 |
| TIBPAL16L8-10CJ | 制造商:TI 制造商全稱:Texas Instruments 功能描述:HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS |
| TIBPAL16L810CN | 制造商:TI 功能描述:New |
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