參數(shù)資料
型號(hào)： THS7002IPWP
廠商： TEXAS INSTRUMENTS INC
元件分類： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PDSO28
封裝： GREEN, PLASTIC, HTSSOP-28
文件頁數(shù)： 24/41頁
文件大?。?/td> 1203K
代理商： THS7002IPWP
THS7001, THS7002
70MHz PROGRAMMABLEGAIN AMPLIFIERS
SLOS214C OCTOBER 1998 REVISED MARCH 2007
30
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations (continued)123456
The actual thermal performance achieved with the THS7001PWP/THS7002PWP in its PowerPAD package
depends on the application. In the example above, if the size of the internal ground plane is approximately
3 inches
× 3 inches (76,2 mm x 76.2 mm), then the expected thermal coefficient, θJA, is about 32.6°C/W for the
THS7001 and 27.9
_C/W for the THS7002. For a given θJA, the maximum power dissipation is shown in Figure
69 and is calculated by the following formula:
P
D +
T
MAX
–T
A
q
JA
Where:
PD
= Maximum power dissipation of THS7001 and THS7002 IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA
= Free-ambient air temperature (
°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to case (THS7001 = 1.4°C/W; THS7002 = 0.72°C/W)
θCA = Thermal coefficient from case to ambient air (°C/W)
THS7002
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
7
6
5
4
3
2
40
20
0
20
40
60
TA Free-Air Temperature _C
W
1
Maximum
Power
Dissipation
80
100
8
TJ = 150 _C
0
θJA = 27.9 _C/W
2 oz. Trace and
Copper Pad With
Solder
θJA = 56.2 _C/W
2 oz. Trace and
Copper Pad
Without Solder
THS7001
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
7
6
5
4
3
2
40
20
0
20
40
60
TA Free-Air Temperature _C
W
1
Maximum
Power
Dissipation
80
100
8
TJ = 150 _C
0
θJA = 32.6 _C/W
2 oz. Trace and
Copper Pad With
Solder
θJA = 74.4 _C/W
2 oz. Trace and
Copper Pad
Without Solder
NOTE A: Results are with no air flow and PCB size = 3”
× 3” (76,2 mm x 76,2 mm)
Figure 69. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments technical brief, PowerPAD Thermally Enhanced Package. This document can be found
at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered
through your local TI sales office. Refer to literature number SLMA002 when ordering.
evaluation board
An evaluation board is available both the THS7001 (literature number SLOP250) and for the THS7002
(literature number SLOP136). These boards has been configured for very low parasitic capacitance in order
to realize the full performance of the amplifiers. These EVM’s incorporate DIP switches to demonstrate the full
capabilities of the THS7001 and THS7002 independent of any digital control circuitry. For more information,
please refer to the THS7001 EVM User’s Guide (literature number SLOU057)and the THS7002 EVM User’s
Guide (literature number SLOU037). To order a evaluation board contact your local TI sales office or distributor.
相關(guān)PDF資料
PDF描述
THS7001IPWP SPECIALTY ANALOG CIRCUIT, PDSO20
TIL5942ANFC 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDIP16
TIL5942NFC 2 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDIP16
TK61220AQ4 SWITCHING REGULATOR, QCC24
TK75003MIBX POWER FACTOR CONTROLLER WITH POST REGULATOR, 1600 kHz SWITCHING FREQ-MAX, PDSO8
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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THS7002IPWPR 功能描述:運(yùn)算放大器 - 運(yùn)放 70-MHz Programmable- Gain Dual RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
THS7002PWP 制造商:TI 制造商全稱:Texas Instruments 功能描述:70-MHz PROGRAMMABLE-GAIN AMPLIFIERS
THS7102 制造商:TI 制造商全稱:Texas Instruments 功能描述:ADSL (POTS) CENTRAL OFFICE LINE INTERFACE DRIVER/RECEIVER
THS7103 制造商:TI 制造商全稱:Texas Instruments 功能描述:ADSL (ISDN) CENTRAL OFFICE LINE INTERFACE DRIVER/RECEIVER
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