參數(shù)資料
型號(hào): THS6182DRG4
廠商: Texas Instruments, Inc.
英文描述: LOW-POWER DISSIPATION ADSL LINE DRIVER
中文描述: 低功耗ADSL線路驅(qū)動(dòng)器
文件頁(yè)數(shù): 21/35頁(yè)
文件大小: 1242K
代理商: THS6182DRG4
www.ti.com
PowerPAD and Via layout
(Pad size 3.65 mm x 2.65 mm ,
9 Vias with diameter = 0.254 mm)
0.682
2.65
3.65
0.563
0.762
1.143
0.4953
0.1905
0.3721
2.2987
4.9022
3.302
5.9182
0.3641
0.4953
0.1905
Pad size
24 x (0.3048 x 0.762) mm
Vias should go through the board connecting the top layer PowerPAD to any and all
ground planes. The larger the ground plane, the more area to distribute the heat.
Solder resist should be used on the bottom side ground plane to prevent wicking of
the solder through the vias during the reflow process.
THS6182
SLLS544G–SEPTEMBER 2002–REVISED NOVEMBER 2004
APPLICATION INFORMATION (continued)
Figure 74. Suggested PCB Layout
The actual thermal performance achieved with the THS6182 in the 20-pin DWP PowerPAD package depends on
the application. In the previous example, if the size of the internal ground plane is approximately 3 inches × 3
inches, then the expected thermal coefficient,
Θ
, is about 21.5°C/W. (See the Package Dissipation Ratings
Table for all other package metrics.) For a given
Θ
JA
, the maximum power dissipation is calculated by the
following formula:
21
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THS6182DW 功能描述:緩沖器和線路驅(qū)動(dòng)器 Low Pwr Dissipation Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
THS6182DWEVM 功能描述:其他開(kāi)發(fā)工具 THS6182DW Eval Mod RoHS:否 制造商:Parallax 產(chǎn)品:ELEV-8 Hex Upgrade Kits 類(lèi)型:Robotics 工具用于評(píng)估:ELEV-8 Quadcopter 工作電源電壓:
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