參數(shù)資料
型號(hào)： THS6022CGQE
廠商： Texas Instruments, Inc.
英文描述： 250-mA DUAL DIFFERENTIAL LINE DRIVER
中文描述： 250毫安雙差分線路驅(qū)動(dòng)器
文件頁(yè)數(shù)： 23/38頁(yè)
文件大?。?/td> 646K
代理商： THS6022CGQE
THS6022
250-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000
23
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
device protection features (continued)
The second built-in protection feature is thermal shutdown. Should the internal junction temperature rise above
approximately 180 C, the device automatically shuts down. Such a condition could exist with improper heat
sinking or if the output is shorted to ground. When the abnormal condition is fixed, the internal thermal shutdown
circuit automatically turns the device back on.
thermal information
The THS6022 is packaged in a thermally-enhanced PWP package, which is a member of the PowerPAD family
of packages. This package is constructed using a downset leadframe upon which the die is mounted
[see Figure 50(a) and Figure 50(b)]. This arrangement results in the lead frame being exposed as a thermal pad
on the underside of the package [see Figure 50(c)]. Because this thermal pad has direct thermal contact with
the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal
pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device. This
is discussed in more detail in the PCB design considerationssection of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 49. Views of Thermally Enhanced PWP Package
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS6022CGQER 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Texas Instruments 功能描述:
THS6022CPWP 功能描述:高速運(yùn)算放大器 250-mA Dual Diff Line Driver RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS6022CPWP 制造商:Texas Instruments 功能描述:LINE DRIVER DIFF SMD HTSSOP14 制造商:Texas Instruments 功能描述:LINE DRIVER, DIFF, SMD, HTSSOP14 制造商:Texas Instruments 功能描述:LINE DRIVER, DIFF, SMD, HTSSOP14; Device Type:Differential; Interface Type:ADSL, HDSL, VDSL; Supply Voltage Min:4.5V; Supply Voltage Max:16V; Driver Case Style:HTSSOP; No. of Pins:14; Operating Temperature Min:0C; Operating ;RoHS Compliant: Yes
THS6022CPWPG4 功能描述:高速運(yùn)算放大器 250-mA Dual Diff Line Driver RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS6022CPWPR 功能描述:高速運(yùn)算放大器 250-mA Dual Diff Line Driver RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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