參數(shù)資料
型號(hào)： THS4130EVM
廠商： Texas Instruments, Inc.
英文描述： HIGH SPEED LOW NOISE, FULLY DIFFERENTIAL I/O AMPLIFIERS
中文描述： 高速低噪音，完全不同的I / O功放
文件頁數(shù)： 2/27頁
文件大?。?/td> 569K
代理商： THS4130EVM
SLOS318E MAY 2000 REVISED JANUARY 2004
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP PowerPAD
(DGN)
THS4130CDGN
EVALUATION
MODULES
TA
SMALL OUTLINE
(D)
MSOP
SYMBOL
AOB
(DGK)
SYMBOL
ATP
0
°
C to 70
°
C
THS4130CD
THS4130CDGK
THS4130EVM
THS4131CD
THS4131CDGN
AOD
THS4131CDGK
ATQ
THS4131EVM
40
°
C to 85
°
C
THS4130ID
THS4130IDGN
AOC
THS4130IDGK
ASO
THS4131ID
THS4131IDGN
AOE
THS4131IDGK
ASP
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
CC
to V
CC+
Input voltage, V
I
Output current, I
O
(see Note 1)
Differential input voltage, V
ID
Continuous total power dissipation
Maximum junction temperature, T
J
(see Note 2)
Maximum junction temperature, continuous operation, long term reliability, T
J
(see Note 3)
Operating free-air temperature, T
A
:C suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds
ESD ratings:
HBM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CDM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
33 V
±
V
CC
150 mA
±
6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
See Dissipation Rating Table
150
°
C
125
°
C
. . . . . . . .
0
°
C to 70
°
C
40
°
C to 85
°
C
65
°
C to 150
°
C
300
°
C
2500 V
1500 V
200 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS413x may incorporate a PowerPad
on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could
permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPad
thermally enhanced package.
NOTE 2: The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
NOTE 3: The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
DISSIPATION RATING TABLE
PACKAGE
(
°
C/W)
θ
JC
(
°
C/W)
POWER RATING
§
TA = 25
°
C
1.02 W
θ
JA
TA = 85
°
C
410 mW
D
97.5
38.3
DGN
58.4
4.7
1.71 W
685 mW
DGK
260
54.2
385 mW
154 mW
This data was taken using the JEDEC standard HighK test PCB.
§Power rating is determined with a junction temperature of 125
°
C. This is the point where distortion starts to
substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125
°
C for best performance and long term reliability.
recommended operating conditions
MIN
±
2.5
TYP
MAX
±
15
UNIT
Supply voltage, VCC+ to VCC
Dual supply
V
Single supply
5
30
C suffix
0
70
°
C
Operating free-air temperature, T
A
I suffix
40
85
PowerPAD is a trademark of Texas Instruments.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS4130ID 功能描述:差分放大器 Ln Diff. In/Out RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 Channel 帶寬:2.4 GHz 可用增益調(diào)整:6 dB to 26 dB 輸入補(bǔ)償電壓: 共模抑制比（最小值）:- 40 dB 工作電源電壓:4.75 V to 5.25 V 電源電流:100 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WQFN-24 封裝:Reel
THS4130ID 制造商:Texas Instruments 功能描述:IC AMP DIFF SMD 4130 SOIC8
THS4130IDG4 功能描述:差分放大器 Fully Differential I/O Low Noise RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 Channel 帶寬:2.4 GHz 可用增益調(diào)整:6 dB to 26 dB 輸入補(bǔ)償電壓: 共模抑制比（最小值）:- 40 dB 工作電源電壓:4.75 V to 5.25 V 電源電流:100 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WQFN-24 封裝:Reel
THS4130IDGK 功能描述:差分放大器 Fully Differential I/O Low Noise RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 Channel 帶寬:2.4 GHz 可用增益調(diào)整:6 dB to 26 dB 輸入補(bǔ)償電壓: 共模抑制比（最小值）:- 40 dB 工作電源電壓:4.75 V to 5.25 V 電源電流:100 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WQFN-24 封裝:Reel
THS4130IDGKG4 功能描述:差分放大器 Fully Differential I/O Low Noise RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 Channel 帶寬:2.4 GHz 可用增益調(diào)整:6 dB to 26 dB 輸入補(bǔ)償電壓: 共模抑制比（最小值）:- 40 dB 工作電源電壓:4.75 V to 5.25 V 電源電流:100 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WQFN-24 封裝:Reel
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