參數(shù)資料
型號(hào)： THS4082EVM
廠商： Texas Instruments, Inc.
英文描述： 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS
中文描述： 175 - MHz的低功耗高速放大器
文件頁(yè)數(shù)： 18/24頁(yè)
文件大?。?/td> 384K
代理商： THS4082EVM
THS4081, THS4082
175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS
SLOS274C – DECEMBER 1999 – REVISED MAY 2000
18
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
The actual thermal performance achieved with the THS408xDGN in its PowerPAD
package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 58.4 C/W. For comparison, the non-PowerPAD
version
of the THS408x IC (SOIC) is shown. For a given
θ
JA
, the maximum power dissipation is shown in Figure 46 and
is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (
°
C/W)
= Maximum power dissipation of THS408x IC (watts)
DGN Package
θ
JA = 58.4
°
C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θ
JA = 158
°
C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θ
JA = 98
°
C/W
TJ = 150
°
C
SOIC Package
Low-K Test PCB
θ
JA = 167
°
C/W
2
1.5
1
0
–40
–20
0
20
40
M
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA – Free-Air Temperature –
°
C
NOTE A: Results are with no air flow and PCB size = 3”
×
3”
Figure 46. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package.This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
相關(guān)PDF資料
PDF描述
THS4081D 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS
THS4081DGN 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS
THS4081EVM 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS
THS4130EVM HIGH SPEED LOW NOISE, FULLY DIFFERENTIAL I/O AMPLIFIERS
THS4211DGKR LOW-DISTORTION HIGH-SPEED VOLTAGE FEEDBACK AMPLIFIER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS4082ID 功能描述:高速運(yùn)算放大器 Dual 175MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4082IDG4 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4082IDGN 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4082IDGNG4 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4082IDGNR 功能描述:高速運(yùn)算放大器 175-MHz Low-Power Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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