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參數(shù)資料
型號(hào)： THS4031CDGNG4
廠商： Texas Instruments
文件頁(yè)數(shù)： 23/47頁(yè)
文件大小： 0K
描述： IC OPAMP VFB 100MHZ SGL 8MSOP
標(biāo)準(zhǔn)包裝： 80
放大器類型： 電壓反饋
電路數(shù)： 1
轉(zhuǎn)換速率： 100 V/µs
-3db帶寬： 100MHz
電流 - 輸入偏壓： 3µA
電壓 - 輸入偏移： 500µV
電流 - 電源： 8.5mA
電流 - 輸出 / 通道： 90mA
電壓 - 電源，單路/雙路(±)： 9 V ~ 32 V，±4.5 V ~ 16 V
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 8-TSSOP，8-MSOP（0.118"，3.00mm 寬）裸露焊盤
供應(yīng)商設(shè)備封裝： 8-MSOP-PowerPad
包裝： 管件
配用： 296-10029-ND - EVAL MOD FOR THS4031
OUT
8
6
1
IN
IN+
2
3
Null
+
1OUT
1IN
1IN+
VCC
2OUT
2IN
2IN+
VCC
8
6
1
2
3
5
7
4
+
+
www.ti.com
SLOS224G – JULY 1999 – REVISED MARCH 2010
FUNCTIONAL BLOCK DIAGRAMS
Figure 1. THS4031 – Single Channel
Figure 2. THS4032 – Dual Channel
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
VALUE
UNIT
VCC
Supply voltage, VCC+ to VCC–
33
V
VI
Input voltage
±VCC
IO
Output current
150
mA
VIO
Differential input voltage
±4
V
Continuous total power dissipation
C-suffix
0 to 70
Operating free-air
TA
I-suffix
–40 to 85
°C
temperature
M-suffix
–55 to 125
TJ
Maximum junction temperature, (any condition)
150
°C
Maximum junction temperature, continuous operation, long term reliability(2)
130
°C
Tstg
Storage temperature
–65 to 150
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package
300
°C
Case temperature for 60 seconds, FK package
260
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device. Does not apply to the JG package or FK package.
DISSIPATION RATINGS TABLE
qJA
qJC
TA = 25°C,
PACKAGE
(°C/W)
POWER RATING
D
167(1)
38.3
629 mW, TJ = 130°C, continuous
DGN(2)
58.4
4.7
1.8 W, TJ = 130°C, continuous
JG
119
28
1050 mW, TJ = 150°C, continuous
FK
87.7
20
1375 mW, TJ = 150°C, continuous
(1)
This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed High-K test PCB, the qJA is 95°C/W with a
power rating at TA = 25°C of 1.32 W.
(2)
This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in. × 3-in. PC. For further information, refer to
Application Information section of this data sheet.
Copyright 1999–2010, Texas Instruments Incorporated
3
Product Folder Link(s): THS4031 THS4032
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