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參數(shù)資料
| 型號(hào)： | TGL4203-EPU |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 衰減器 |
| 英文描述： | 50 GHz Wideband Analog Attenuator |
| 中文描述： | 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR, 2 dB INSERTION LOSS-MAX |
| 封裝： | 1.70 X 0.80 MM, 0.10 MM HEIGHT, DIE-7 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大?。?/td> | 367K |
| 代理商： | TGL4203-EPU |
TriQuint Semiconductor Texas : Phone (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
January 18, 2005
TGL4203-EPU
10
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
Assembly Process Notes
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Reflow process assembly notes:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 C (30 seconds max).
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire.
Maximum stage temperature is 200 C.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| TGL4203-SM | 功能描述:有源衰減器 DC-30 GHz Analog Atten (17dB) RoHS:否 制造商:TriQuint Semiconductor 通道數(shù)量: 最大頻率: 阻抗: 最大 VSWR: 位數(shù): 最大工作溫度: 最小工作溫度: |
| TGL4203-SM, T/R | 功能描述:衰減器 -IC DC-30GHz IL 1.5dB Range 17dB RL 15dB RoHS:否 制造商:Skyworks Solutions, Inc. 最大衰減:18 dB 容差: 阻抗: 功率額定值:30 dBm 安裝風(fēng)格:SMD/SMT 工作溫度范圍:- 40 C to + 85 C |
| TGL4203-SM-T/R | 制造商:TriQuint Semiconductor 功能描述:ATTENUATOR - VARIABLE VOLTAGE |
| TGL6425 | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:Digital Attenuator |
| TGL6425-SCC | 功能描述:射頻放大器 0.5-18GHz Digital Attenuator (15.5dB) RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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