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參數(shù)資料
| 型號： | TGC1430E |
| 廠商： | TriQuint Semiconductor,Inc. |
| 英文描述： | Single-Balanced Down Converter |
| 中文描述： | 單平衡下變頻器 |
| 文件頁數(shù)： | 3/3頁 |
| 文件大?。?/td> | 385K |
| 代理商： | TGC1430E |
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
August 29, 2000
Reflow process assembly notes:
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AuSn (80/20) solder with limited exposure to temperatures at or above 300
Γ
C
alloy station or conveyor furnace with reducing atmosphere
no fluxes should be utilized
coefficient of thermal expansion matching is critical for long-term reliability
storage in dry nitrogen atmosphere
Component placement and adhesive attachment assembly notes:
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vacuum pencils and/or vacuum collets preferred method of pick up
avoidance of air bridges during placement
force impact critical during auto placement
organic attachment can be used in low-power applications
curing should be done in a convection oven; proper exhaust is a safety concern
microwave or radiant curing should not be used because of differential heating
coefficient of thermal expansion matching is critical
Interconnect process assembly notes:
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thermosonic ball bonding is the preferred interconnect technique
force, time, and ultrasonics are critical parameters
aluminum wire should not be used
discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire
maximum stage temperature: 200
Γ
C
Assembly Process Notes
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TGC1430E
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TGC1430F-EPU | 20 - 40 GHz X2 Frequency Multiplier |
| TGC1430F | 20 - 40 GHz X2 Frequency Multiplier |
| TGC1430G-EPU | 20 - 40 GHz X3 Frequency Multiplier |
| TGC1430G | 20 - 40 GHz X3 Frequency Multiplier |
| TGC1430H | 20 - 40 GHz IQ Mixer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TGC1430F | 功能描述:時鐘發(fā)生器及支持產(chǎn)品 20-40GHz Doubler RoHS:否 制造商:Silicon Labs 類型:Clock Generators 最大輸入頻率:14.318 MHz 最大輸出頻率:166 MHz 輸出端數(shù)量:16 占空比 - 最大:55 % 工作電源電壓:3.3 V 工作電源電流:1 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-56 |
| TGC1430F-EPU | 制造商:TriQuint Semiconductor 功能描述:20-40GHZ DOUBLER |
| TGC1430G | 功能描述:時鐘發(fā)生器及支持產(chǎn)品 20-40GHz Tripler RoHS:否 制造商:Silicon Labs 類型:Clock Generators 最大輸入頻率:14.318 MHz 最大輸出頻率:166 MHz 輸出端數(shù)量:16 占空比 - 最大:55 % 工作電源電壓:3.3 V 工作電源電流:1 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-56 |
| TGC1430G-EPU | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:20 - 40 GHz X3 Frequency Multiplier |
| TGC1430H | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:20 - 40 GHz IQ Mixer |
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