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參數(shù)資料
| 型號： | TGB2010-00-EPU |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 英文描述： | Bessel Filter |
| 中文描述： | BAND PASS FILTER |
| 文件頁數(shù)： | 7/7頁 |
| 文件大?。?/td> | 214K |
| 代理商： | TGB2010-00-EPU |
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
September 22, 2003
7
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Reflow process assembly notes:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 C.
(30 seconds maximum)
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Maximum stage temperature is 200 C.
Assembly Process Notes
TGB2010-EPU
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PDF描述 |
|---|---|
| TGC1411 | 0.3 - 10 GHz Downconverter |
| TGC1411-EPU | 0.3 - 10 GHz Downconverter |
| TGC1430E | Single-Balanced Down Converter |
| TGC1430F-EPU | 20 - 40 GHz X2 Frequency Multiplier |
| TGC1430F | 20 - 40 GHz X2 Frequency Multiplier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TGB2010-00-EPU-SM | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:5GHz - 9GHz Packaged Bessel Filter |
| TGB2010-00-SM | 功能描述:信號調(diào)節(jié) Bessel Filter RoHS:否 制造商:EPCOS 產(chǎn)品:Duplexers 頻率:782 MHz, 751 MHz 頻率范圍: 電壓額定值: 帶寬: 阻抗:50 Ohms 端接類型:SMD/SMT 封裝 / 箱體:2.5 mm x 2 mm 工作溫度范圍:- 30 C to + 85 C 封裝:Reel |
| TGB2010-06 | 功能描述:有源濾波器 Bessel Filter (6GHz Fco) RoHS:否 制造商:Maxim Integrated 通道數(shù)量:1 截止頻率:150 KHz 電源電壓-最大:11 V 電源電壓-最小:4.74 V 最大工作溫度:+ 85 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP N 封裝:Tube |
| TGB2010-06-EPU | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:Bessel Filter |
| TGB2010-07 | 功能描述:有源濾波器 Bessel Filter 7GHz Fco RoHS:否 制造商:Maxim Integrated 通道數(shù)量:1 截止頻率:150 KHz 電源電壓-最大:11 V 電源電壓-最小:4.74 V 最大工作溫度:+ 85 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP N 封裝:Tube |
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