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參數(shù)資料
| 型號： | TEMT3700-GS08 |
| 廠商： | VISHAY SEMICONDUCTORS |
| 元件分類： | 光敏三極管 |
| 英文描述： | Photo Transistor, PHOTO TRANSISTOR DETECTOR, ROHS COMPLIANT, MINIATURE, PLASTIC, SMD, LCC-2 |
| 中文描述： | Photodetector Transistors 60 Degree 160mW |
| 文件頁數(shù)： | 1/6頁 |
| 文件大?。?/td> | 121K |
| 代理商： | TEMT3700-GS08 |
Document Number: 81555
Rev. 1.7, 10-Oct-08
For technical questions, contact: detectortechsupport@vishay.com
www.vishay.com
1
Silicon NPN Phototransistor, RoHS Compliant
TEMT3700
Vishay Semiconductors
DESCRIPTION
TEMT3700 is a high speed silicon NPN epitaxial planar
phototransistor in a miniature PLCC-2 package for surface
mounting on printed boards. The device is sensitive to visible
and near infrared radiation.
FEATURES
Package type: surface mount
Package form: PLCC-2
Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
High photo sensitivity
High radiant sensitivity
Suitable for visible and near infrared radiation
Fast response times
Angle of half sensitivity:
= ± 60°
Package notch indicates collector
Package matched with IR emitter series VSML3710
Floor life: 1 year, MSL 2, acc. J-STD-020
Lead
(Pb)-free
component
RoHS 2002/95/EC and WEEE 2002/96/EC
APPLICATIONS
Photo interrupters
Miniature switches
Counters
Encoders
Position sensors
Ligth sensors
in
accordance
with
Note
Test conditions see table “Basic Characteristics”
Note
MOQ: minimum order quantity
Note
T
amb
= 25 °C, unless otherwise specified
94
8
553
PRODUCT SUMMARY
COMPONENT
TEMT3700
I
ca
(mA)
0.5
(deg)
± 60
λ
0.1
(nm)
450 to 1080
ORDERING INFORMATION
ORDERING CODE
TEMT3700-GS08
TEMT3700-GS18
PACKAGING
Tape and reel
Tape and reel
REMARKS
PACKAGE FORM
PLCC-2
PLCC-2
MOQ: 7500 pcs, 1500 pcs/reel
MOQ: 8000 pcs, 8000 pcs/reel
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector emitter voltage
Emitter collector voltage
Collector current
Collector peak current
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
TEST CONDITION
SYMBOL
V
CEO
V
ECO
I
C
I
CM
P
V
T
j
T
amb
T
stg
T
sd
R
thJA
VALUE
70
5
50
100
100
100
- 40 to + 100
- 40 to + 100
260
400
UNIT
V
V
mA
mA
mW
°C
°C
°C
°C
K/W
t
p
/T
≤
0.1, t
p
≤
10 μs
Acc. reflow solder profile fig. 10
Soldered on PCB with pad dimensions: 4 mm x 4 mm
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