參數(shù)資料
型號(hào)： TEA6886
廠商： NXP Semiconductors N.V.
英文描述： Up-level Car radio Analog Signal Processor CASP
中文描述： 截至級(jí)車電臺(tái)模擬信號(hào)處理器支持核心計(jì)劃
文件頁(yè)數(shù)： 2/92頁(yè)
文件大?。?/td> 376K
代理商： TEA6886
2000 Nov 21
2
Philips Semiconductors
Product specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
CONTENTS
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
7.1
7.2
7.3
7.4
FEATURES
General
Stereo decoder and noise blanking
Weak signal processing
Audio pre-amplifier
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Stereo decoder
FM noise blanker
AM noise blanker
Multipath/fading detection and weak signal
control
Tone/volume control
Source selector
Loudness
Volume 1
Treble
Bass
Volume 2
RSA selector
Chime adder
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I
2
C-BUS PROTOCOL
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
7.5.6
7.5.7
7.5.8
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.13
11.14
11.15
11.16
12
13
14
15
15.1
Read mode: 1st data byte
Read mode: 2nd data byte
Subaddress byte for write
Write mode: subaddress 0H
Write mode: subaddress 1H
Write mode: subaddress 2H
Write mode: subaddress 3H
Write mode: subaddress 4H
Write mode: subaddress 5H
Write mode: subaddress 6H
Write mode: subaddress 7H
Write mode: subaddress 8H
Write mode: subaddress 9H
Write mode: subaddress AH
Write mode: subaddress BH
Write mode: subaddress CH
INTERNAL CIRCUITRY
TEST CIRCUIT
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
15.2
15.3
15.4
15.5
16
17
18
19
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TEA6886HL 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Up-level Car radio Analog Signal Processor CASP
TEA6886HL/V2,518 功能描述:IC CAR RADIO ASP 80-LQFP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻處理 系列:- 其它有關(guān)文件:STA321 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:Sound Terminal™ 類型:音頻處理器 應(yīng)用:數(shù)字音頻 安裝類型:表面貼裝 封裝/外殼:64-LQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-LQFP EP（10x10） 包裝:Digi-Reel® 其它名稱:497-11050-6
TEA6R8M1HBK-0512P 功能描述:鋁質(zhì)電解電容器 - 帶引線 50V 6.8uF 20% RoHS:否 制造商:Kemet 引線類型: 電容:220 uF 容差:20 % 電壓額定值:25 V 工作溫度范圍: 端接類型:Radial 外殼直徑:8 mm 外殼長(zhǎng)度:11 mm 引線間隔:5 mm 產(chǎn)品:General Purpose Electrolytic Capacitors 封裝:Bulk
TEA6R8M1HTR-0512P 功能描述:鋁質(zhì)電解電容器 - 帶引線 50VOLT 6.8uF 20% RoHS:否 制造商:Kemet 引線類型: 電容:220 uF 容差:20 % 電壓額定值:25 V 工作溫度范圍: 端接類型:Radial 外殼直徑:8 mm 外殼長(zhǎng)度:11 mm 引線間隔:5 mm 產(chǎn)品:General Purpose Electrolytic Capacitors 封裝:Bulk
TEA6R8M1JBK-0613P 功能描述:鋁質(zhì)電解電容器 - 帶引線 63V 6.8uF 20% RoHS:否 制造商:Kemet 引線類型: 電容:220 uF 容差:20 % 電壓額定值:25 V 工作溫度范圍: 端接類型:Radial 外殼直徑:8 mm 外殼長(zhǎng)度:11 mm 引線間隔:5 mm 產(chǎn)品:General Purpose Electrolytic Capacitors 封裝:Bulk
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