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參數(shù)資料
| 型號： | TEA6880H |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | Up-level Car radio Analog Signal Processor CASP |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP64 |
| 封裝： | 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, SOT-319-2, QFP-64 |
| 文件頁數(shù)： | 2/88頁 |
| 文件大?。?/td> | 328K |
| 代理商： | TEA6880H |
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2000 May 08
2
Philips Semiconductors
Product specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6880H
CONTENTS
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
7.1
7.2
7.3
7.4
FEATURES
General
Stereo decoder and noise blanking
Weak signal processing
Audio pre-amplifier
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Stereo decoder
FM noise blanker
AM noise blanker
Multipath/fading detection and weak signal
control
Tone/volume control
Source selector
Loudness
Volume 1
Treble
Bass
Volume 2
RSA selector
Chime adder
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I
2
C-BUS PROTOCOL
Read mode: 1st data byte
Read mode: 2nd data byte
Subaddress byte for write
Write mode: subaddress 0H
Write mode: subaddress 1H
Write mode: subaddress 2H
Write mode: subaddress 3H
Write mode: subaddress 4H
Write mode: subaddress 5H
Write mode: subaddress 6H
Write mode: subaddress 7H
Write mode: subaddress 8H
Write mode: subaddress 9H
Write mode: subaddress AH
Write mode: subaddress BH
Write mode: subaddress CH
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
7.5.6
7.5.7
7.5.8
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.13
11.14
11.15
11.16
12
13
14
14.1
INTERNAL CIRCUITRY
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
14.2
14.3
14.4
14.5
15
16
17
18
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| TEA6886 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Up-level Car radio Analog Signal Processor CASP |
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