參數(shù)資料
型號: TEA6849H
廠商: NXP SEMICONDUCTORS
元件分類: 接收器
英文描述: New In Car Entertainment car radio tuner IC with Precision Adjacent Channel Suppression
中文描述: AM/FM, AUDIO SINGLE CHIP RECEIVER, PQFP80
封裝: 12 X 12 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-315-1, LQFP-80
文件頁數(shù): 2/65頁
文件大?。?/td> 405K
代理商: TEA6849H
2003 Dec 19
2
Philips Semiconductors
Product specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
TEA6849H
CONTENTS
1
2
3
4
5
6
7
7.1
7.1.1
7.1.2
7.1.3
7.2
7.3
7.3.1
7.3.2
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Oscillators
VCO
PLL
Crystal oscillator
DAA
FM signal channel
FM mixer 1
Buffer output for weather band flag
(pin WBFLAG)
FM keyed AGC
FM IF amplifier
FM mixer 2
FM IF2 dynamic selectivity
FM quadrature demodulator
FM MPX soft mute
Adjacent channel detector and threshold
extension
Bandwidth control ‘a(chǎn)ctive’ flag (pin IFBWFLAG)
Bandwidth control monitor voltage (pin V
IFBW
)
AM signal channel
AM tuner including mixer 1 and mixer 2
AM RF AGC
AM detector
AM noise blanker
FM and AM level detector
LIMITING VALUES
THERMAL CHARACTERISTICS
7.3.3
7.3.4
7.3.5
7.3.6
7.3.7
7.3.8
7.3.9
7.3.10
7.3.11
7.4
7.4.1
7.4.2
7.4.3
7.4.4
7.5
8
9
10
11
12
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.2
12.2.1
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
12.2.7
12.2.8
12.2.9
12.2.10
13
14
15
16
16.1
DC CHARACTERISTICS
AC CHARACTERISTICS
I
2
C-BUS PROTOCOL
I
2
C-bus specification
Data transfer
I
2
C-bus pull-up resistors
Frequency setting
Default settings
I
2
C-bus protocol
Data transfer mode and IC address
Write mode: data byte 0
Write mode: data byte 1
Write mode: data byte 2
Write mode: data byte 3
Write mode: data byte 4
Write mode: data byte 5
Write mode: data byte 6
Write mode: data byte 7
Read mode: data byte 0
TEST AND APPLICATION INFORMATION
INTERNAL CIRCUITRY
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
16.2
16.3
16.4
16.5
17
18
19
20
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