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參數(shù)資料
| 型號： | TEA5768 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | single-chip FM stereo radio |
| 中文描述： | 單芯片F(xiàn)M立體聲收音機 |
| 文件頁數(shù)： | 33/36頁 |
| 文件大?。?/td> | 196K |
| 代理商： | TEA5768 |
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2004 Sep 13
33
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
16.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note”(AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
2.
3.
4.
5.
6.
7.
8.
9.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, HTSSON..T
(3)
, LBGA, LFBGA, SQFP, SSOP..T
(3)
, TFBGA,
VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC
(5)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
(8)
, PMFP
(9)
, WQCCN..L
(8)
not suitable
suitable
not suitable
(4)
suitable
suitable
not recommended
(5)(6)
not recommended
(7)
not suitable
suitable
suitable
suitable
not suitable
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TEA5768HL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low-power FM stereo radio for handheld applications |
| TEA5768HL/V2,157 | 功能描述:調諧器 LO-PWR FM STEREO RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度: |
| TEA5768HL2FE | 功能描述:IC FM STEREO LOW POWER 32LQFP RoHS:是 類別:RF/IF 和 RFID >> RF 接收器 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS 產(chǎn)品變化通告:Product Discontinuation 09/Jan/2012 標準包裝:50 系列:* 頻率:850MHz ~ 2.175GHz 靈敏度:- 數(shù)據(jù)傳輸率 - 最大:- 調制或協(xié)議:- 應用:* 電流 - 接收:* 數(shù)據(jù)接口:PCB，表面貼裝 存儲容量:- 天線連接器:PCB，表面貼裝 特點:- 電源電壓:4.75 V ~ 5.25 V 工作溫度:0°C ~ 85°C 封裝/外殼:40-WFQFN 裸露焊盤 供應商設備封裝:40-TQFN-EP（6x6） 包裝:托盤 |
| TEA5768HLBD | 功能描述:調諧器 LO-PWR FM STEREO RADIO RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度: |
| TEA5777 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low-power AM/FM stereo radio for handheld applications |
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