2000 Sep 08
10
Philips Semiconductors
Product specification
STARplug
TM
TEA152x family
THERMAL CHARACTERISTICS
Note
1.
Thermal resistance R
th(j-a)
can be lower when the GND pins are connected to sufficient copper area on the
printed-circuit board. See the TEA152x application notes for details.
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611 part E”
CHARACTERISTICS
T
amb
= 25
°
C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing
into the IC; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
TEA152xP
TEA152xT
TEA152xAJM
note 1
in free air
in free air
in free air
100
91
65
K/W
K/W
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
I
CC(operate)
I
CC(startup)
I
drain
supply current
start-up supply current
supply current drawn from DRAIN
pin
normal operation
start-up
no auxiliary supply; V
drain
> 60 V
with auxiliary supply; V
drain
> 60 V
V
drain
> 60 V
6
9
7.0
1.3
180
1.5
30
4
9.5
7.5
1.9
400
2
125
3
10
8.0
mA
μ
A
mA
μ
A
mA
V
V
I
CC(ch)
V
CC(start)
V
CC(stop)
V
CC
pin charging current
V
CC
start voltage
V
CC
stop voltage (under voltage
lock-out)
Pulse width modulator
δ
min
δ
max
SOPS
minimum duty factor
maximum duty factor
0
75
%
%
f = 100 kHz
V
demag
demagnetization recognition
voltage level
suppression of transformer ringing
at start of secondary stroke
50
100
150
mV
t
suppr
1.0
1.5
2.0
μ
s
RC oscillator
V
RC(min)
minimum voltage of RC oscillator
setting
maximum voltage of RC oscillator
setting
RC charging time
frequency range of oscillator
60
75
90
mV
V
RC(max)
2.4
2.5
2.6
V
t
RC(ch)
f
osc
10
1
100
200
μ
s
kHz