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參數資料
| 型號： | TEA1522A |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | STARplug |
| 中文描述： | STARplug |
| 文件頁數： | 17/20頁 |
| 文件大?。?/td> | 114K |
| 代理商： | TEA1522A |
2000 Sep 08
17
Philips Semiconductors
Product specification
STARplug
TM
TEA152x family
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
DIPPING
suitable
suitable
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
(2)
not suitable
not suitable
(3)
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
相關PDF資料 |
PDF描述 |
|---|---|
| TEA1523AJM | CAP .33UF 16V PEN FILM 2416 5% |
| TEA1523T | STARplug |
| TEA1524AJM | STARplug |
| TEA1522AJM | STARplug |
| TEA1520 | STARplug |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TEA1522AJM | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:STARplug |
| TEA1522P | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SMPS ICs for low-power systems |
| TEA1522P/N2,112 | 功能描述:開關變換器、穩(wěn)壓器與控制器 POWERPLUG RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關頻率:1 MHz 工作溫度范圍: 安裝風格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| TEA1522P/N2.112 | 制造商:NXP Semiconductors 功能描述:IC STARPLUG POWER CONVERSION 1522 制造商:NXP Semiconductors 功能描述:IC, STARPLUG POWER CONVERSION, 1522 |
| TEA1522PN | 功能描述:開關變換器、穩(wěn)壓器與控制器 POWERPLUG RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關頻率:1 MHz 工作溫度范圍: 安裝風格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
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