參數(shù)資料
型號: TDM15014A
廠商: MICROSEMI POWER PRODUCTS GROUP
元件分類: 參考電壓二極管
英文描述: 150 A, 1400 V, SILICON, RECTIFIER DIODE
封裝: ROHS COMPLIANT PACKAGE-2
文件頁數(shù): 1/2頁
文件大?。?/td> 117K
代理商: TDM15014A
*Add Suffix A for Common Anode, D for Doubler
ROHS Compliant
Twin Diode Module
TDM150
Microsemi
Catalog Number
TDM15002*
TDM15004*
TDM15006*
TDM15008*
TDM15010*
TDM15012*
TDM15014*
TDM15016*
800V
1000V
1200V
1400V
1600V
600V
400V
200V
Reverse Voltage
Repetitive Peak
Compact Package
Glass Passivated Die
2 x 150 Amp Current Rating
Electrical Characteristics
Average forward current per pkg
Average forward current per leg
Maximum surge current per leg
Max I t for fusing
Max peak forward voltage per leg
Max peak reverse current per leg
Typical reverse current per leg
F(AV) 300 Amps
F(AV) 150 Amps
FSM 2500 Amps
I t
26000 A s
FM 1.1 volts
RM 5 mA
RM 50 uA
I
I
I
V
I
I
C = 120°C, half sine, 0JC = 0.30°C/W
8.3 ms, half sine, J = 175°C
FM = 200A: J = 25°C*
RRM, J = 150°C
RRM, J = 25°C
T
T
V
V
I
*Pulse test: Pulse width 300μsec, Duty cycle 2%
Thermal and Mechanical Characteristics
Simplifies Circuit Assembly
Storage temp range
Operating junction temp range
Max thermal resistance per leg
Typical thermal resistance per leg (greased)
Terminal Torque
Mounting Base Torque (outside holes)
Mounting Base Torque (center hole)
-55°C to 175°C
-55°C to 175°C
0.3°C/W
40-50 inch pounds
30-40 inch pounds
8-10 inch pounds
0.08°C/W
T
T
R
R
OJC
OCS
Case to sink
Weight
2.82 ounces (80 grams) typical
Dim. Inches
Millimeters
Min.
A
B
C
E
F
G
H
N
Q
R
U
V
W
Y
---
17.78
---
3.05
12.45
---
6.86
15.24
8.38
4.32
92.20
20.32
15.87
3.30
12.95
1.27
7.11
---
8.89
4.82
---
0.700
---
0.120
0.490
---
.280
0.600
0.330
0.170
3.630
0.800
0.625
0.130
0.510
0.050
.310
---
0.350
0.190
Dia.
Dia.
34.92 BSC
1.375 BSC
---
1/4-20 UNC
80.01 BSC
3.150 BSC
46.10 BSC
1.815 BSC
A
R
G
Y
U
F
U
V
B
E
C
H
Q
N
W
Min.
Max.
Max.
Notes
Working Peak
Reverse Voltage
200V
400V
600V
800V
1000V
1200V
1400V
1600V
High Surge Capacity
STG
J
Junction to case
C = 120°C, half sine, 0JC = 0.15°C/W
center hole must be torqued first
Notes:
Baseplate: Nickel plated
copper
D=Doubler
Baseplate
A=Common Anode
Baseplate
Common Cathode
Baseplate
January, 2010 - Rev. 3
www.microsemi.com
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