- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371183 > TDA9964 (NXP Semiconductors N.V.) 12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras PDF資料下載
參數(shù)資料
| 型號： | TDA9964 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras |
| 中文描述： | 12位，為3.0 V，30 Msps的模擬到數(shù)字的CCD相機接口 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 109K |
| 代理商： | TDA9964 |
2000 May 02
20
Philips Semiconductors
Objective specification
12-bit, 3.0 V, 30 Msps analog-to-digital
interface for CCD cameras
TDA9964
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關PDF資料 |
PDF描述 |
|---|---|
| TDA9964HL | 12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras |
| TDA9965A | 12-bit, 5.0 V, 40 Msps analog-to-digital interface for CCD cameras |
| TDA9965AHL | 12-bit, 5.0 V, 40 Msps analog-to-digital interface for CCD cameras |
| TDD1742T | CMOS FREQUENCY SYNTHESIZER |
| TDF5140 | Brushless DC motor drive circuit |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TDA9964HL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras |
| TDA9965 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit, 5.0 V, 30 Msps analog-to-digital interface for CCD cameras |
| TDA9965A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit, 5.0 V, 40 Msps analog-to-digital interface for CCD cameras |
| TDA9965AHL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:12-bit, 5.0 V, 40 Msps analog-to-digital interface for CCD cameras |
| TDA9965AHL/C3,118 | 功能描述:CCD CAMERA INTERFACE 48LQFP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)（DAS） 分辨率（位）:16 b 采樣率（每秒）:21.94k 數(shù)據(jù)接口:MICROWIRE?，QSPI?，串行，SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應商設備封裝:40-TQFN-EP（6x6） 包裝:托盤 |
發(fā)布緊急采購，3分鐘左右您將得到回復。
