參數(shù)資料
型號: TDA8931T
廠商: NXP SEMICONDUCTORS
元件分類: 消費家電
英文描述: Power comparator 1 X 20 W
中文描述: SPECIALTY CONSUMER CIRCUIT, PDSO20
封裝: 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20
文件頁數(shù): 19/31頁
文件大?。?/td> 165K
代理商: TDA8931T
9397 750 13847
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 01 — 14 January 2004
19 of 31
Philips Semiconductors
TDA8931
Power comparator 1
×
20 W
14.4.1
Thermal layout including vias
The bottom side of the double-sided PCB is used to place the SMD components including
the TDA8931T and the majority of the signal tracks. The topside is used to place the
leaded components.
The remaining area on both top and bottom layer are filled with ground plane for a proper
cooling. In this way it is possible to have a cooling area available of about:
40 % of the PCB area on the bottom (60 % for signal tracks and SMD components)
90 % of the PCB area on the top (10 % for signal tracks)
The PCB area required for a typical mono amplifier is 21.5 cm
2
resulting in a cooling area
of about 28 cm
2
. Thermal vias should be placed close to corner leads for a proper heat
flow to the top layer of the PCB.
Figure 7
is showing the thermal vias indicated as black
dots and
Figure 8
is showing the heat flow to the copper area on the top layer.
14.4.2
Thermal considerations
To estimate the maximum junction temperature, the following equation can be used:
(5)
Where:
T
amb
= ambient temperature
P
d
= power dissipation in the TDA8931T
R
th(j-a)
= thermal resistance from junction to ambient (24 K/W)
Fig 7.
Thermal vias (top view)
Fig 8.
Heat flow (cross section view)
001aac238
20
11
10
1
TDA8931T
001aac239
top layer
bottom layer
T
j max
)
T
amb
R
th j
a
(
)
P
d
×
+
=
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