參數(shù)資料
型號(hào)： TDA8589BJ
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： I2C-bus controlled 4 45 Watt power amplifier and multiple voltage regulator
中文描述： SPECIALTY CONSUMER CIRCUIT, PZFM37
封裝： PLASTIC, SOT725-1, 37 PIN
文件頁(yè)數(shù)： 52/55頁(yè)
文件大?。?/td> 561K
代理商： TDA8589BJ
2004 Feb 24
52
Philips Semiconductors
Product speci
cation
I
2
C-bus controlled 4 45 Watt power
ampli
er and multiple voltage regulator
TDA8589J; TDA8589xJ
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. Amore in-depth account ofsoldering ICs can be
found in our
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 C or 265 C, depending on solder
material applied, SnPb or Pb-free respectively.
The total contacttime ofsuccessive solderwaves mustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Notes
1.
2.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
For PMFP packages hot bar soldering or manual soldering is suitable.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
(2)
suitable
suitable
(1)
not suitable
相關(guān)PDF資料
PDF描述
TDA8589J I2C-bus controlled 4 45 Watt power amplifier and multiple voltage regulator
TDA8742H Satellite sound circuit with noise reduction
TDA8922B 2 X 50 W class-D power amplifier
TDA9102CT H/V PROCESSOR FOR TTL V.D.U
TDA9102T H/V PROCESSOR FOR TTL V.D.U
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA8589BJ/N3 功能描述:音頻放大器 POWER AMPL + STABI RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8589BJ/N3,112 功能描述:音頻放大器 POWER AMPL + STABI RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8589J 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled 4 45 Watt power amplifier and multiple voltage regulator
TDA8589J/N1,112 功能描述:音頻放大器 MULTI CHIP MODULE IPAS2.45 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8591 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4 X 44 W into 4 or 4 X 75 W into 2 quad BTL car radio power amplifier
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*