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參數(shù)資料
| 型號： | TDA8260TW |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | Satellite Zero-IF QPSK/8PSK downconverter with PLL synthesizer |
| 中文描述： | RF/MICROWAVE DOWN CONVERTER |
| 封裝： | PLASTIC, SOT633-3, HTSSOP-38 |
| 文件頁數(shù)： | 18/23頁 |
| 文件大?。?/td> | 143K |
| 代理商： | TDA8260TW |
2004 Sep 03
18
Philips Semiconductors
Product specification
Satellite Zero-IF QPSK/8PSK
downconverter with PLL synthesizer
TDA8260TW
PACKAGE OUTLINE
UNIT
A1
A2
A3
bp
c
E
(2)
D
(1)
e
HE
L
Lp
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT633-3
04-01-22
w
M
θ
A
A1
A2
Eh
Dh
D
Lp
detail X
E
Z
exposed die pad side
e
c
L
X
(A3)
0.25
1
19
38
20
y
bp
HE
1.05
0.80
0.30
0.19
Dh
3.65
3.45
Eh
2.85
2.65
0.20
0.09
12.6
12.4
6.2
6.0
8.3
7.9
0.65
1
0.2
0.6
0.2
0.1
0.75
0.45
v
M
A
A
HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT633-3
A
max.
1.2
0
2.5
5 mm
scale
- - -
- - -
- - -
pin 1 index
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