參數(shù)資料
型號(hào): TCA0372DWR2
廠商: ON Semiconductor
文件頁(yè)數(shù): 10/10頁(yè)
文件大小: 0K
描述: IC OPAMP DUAL POWER 1A 16SOIC
產(chǎn)品變化通告: Product Obsolescence 11/Feb/2009
標(biāo)準(zhǔn)包裝: 1
放大器類型: 通用
電路數(shù): 2
轉(zhuǎn)換速率: 1.4 V/µs
增益帶寬積: 1.4MHz
電流 - 輸入偏壓: 100nA
電壓 - 輸入偏移: 1000µV
電流 - 電源: 5mA
電流 - 輸出 / 通道: 1A
電壓 - 電源,單路/雙路(±): 5 V ~ 40 V,±2.5 V ~ 20 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC W
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: TCA0372DWR2OSDKR
TCA0372, TCA0372B, NCV0372B
http://onsemi.com
9
PACKAGE DIMENSIONS
SOIC16 WB
CASE 751G03
ISSUE D
D
14X
B
16X
SEATING
PLANE
S
A
M
0.25
B S
T
16
9
8
1
h
X
45
_
M
B
M
0.25
H
8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN
MAX
MILLIMETERS
A
2.35
2.65
A1
0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0
7
_
11.00
16X
0.58
16X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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