TC1073
3
PRELIMINARY INFORMATION
TC1073-01 6/5/97
100mA CMOS LDO WITH SHUTDOWN,
ERROR OUTPUT AND V
REF
BYPASS
PIN DESCRIPTION
Pin No.
(SOT-23A-6)
Symbol
Description
1
2
3
V
IN
GND
SHDN
Unregulated supply input.
Ground terminal.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05 microamp (typical).
Out-of-Regulation Flag. (Open drain output). This output goes low when V
OUT
is out-of-tolerance
by approximately – 5%.
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
Regulated voltage output.
4
ERROR
5
6
Bypass
V
OUT
ELECTRICAL CHARACTERISTICS:
V
IN
= V
OUT
+ 1V, I
L
= 0.1
μ
A, C
L
= 3.3
μ
F, SHDN > V
IH
, T
A
= 25
°
C, unless otherwise noted.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
ERROR Open Dranin Output
V
MIN
V
OL
V
TH
V
HYS
NOTES:
1. V
R
is the regulator output voltage setting. (V
R
= 2.5V, 2.7V, 3.0V, 3.3V, 5.0V).
2. TC V
OUT
= (V
OUTMAX –
V
OUTMIN
)
x 10
6
V
x
T
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the
thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load
current, ground current and supply current (i.e. I
IN
= I
SUPPLY
+ I
GND
+ I
LOAD
).
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to I
LMAX
at V
IN
= 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e. T
A
, T
J
, q
JA
). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Thermal Considerationssection of this data sheet for more details.
8. Hysteresis voltage is referenced by V
R
.
9. Boldface type specifications apply for junction temperatures of – 40
°
C to +125
°
C.
Minimum Operating Voltage
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
1.0
—
—
—
—
—
—
400
—
—
V
1mA Flows to ERROR
See Figure 2
Note 8
mV
V
mV
0.95 x V
R
50