參數(shù)資料
型號(hào)： T491C224M035AT
廠商： KEMET Corporation
英文描述： Surface Mount Capacitors
中文描述： 表面貼裝電容
文件頁(yè)數(shù)： 15/100頁(yè)
文件大小： 4351K
代理商： T491C224M035AT
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Shear Force
Table 8 Maximum Shear Loads
Case Code
Maximum Shear Loads
Kilograms
2.4
3.2
3.6
4.5
5.0
3.2
3.6
4.5
5.0
5.0
5.0
KEMET
R
S
T
U
V
A
B
C
D
X
E
EIA
Pounds
5.3
7.0
8.0
10.0
11.0
7.0
8.0
10.0
11.0
11.0
11.0
2012-12
3216-12
3528-12
6032-15
7343-20
3216-18
3528-21
6032-28
7343-31
7343-43
7260-38
SOLID TANTALUM CHIP CAPACITORS
and Pb-Free soldering processes.
90Sn/10Pb terminations are also available and
can be ordered with an "H" suffix.
KEMET's "S" suffix remains an active termination
designator for current designs but is not recom-
mended for new designs. Parts ordered with an
"S" suffix are not guaranteed to be Pb-Free or
RoHS compliant. Refer to www.kemet.com for
information on Pb-Free transition.
For conductive adhesive attachment processes, a
gold termination finish is available for most series and
case sizes. Refer to the specific series for details.
34. Recommended Mounting Pad Geometries
Proper mounting pad geometries are essential
for successful solder connections. These dimen-
sions are highly process sensitive and should be
designed to maximize the integrity of the solder
joint, and to minimize component rework due to
unacceptable solder joints.
Figure 12 illustrates pad geometry. Tables 9 &
10 provide recommended pad dimensions for
both wave and reflow soldering techniques.
These dimensions are intended to be a starting
point for circuit board designers, to
be fine tuned, if necessary, based upon the pecu-
liarities of the soldering process and/or circuit
board design.
Contact KEMET for Engineering Bulletin Number
F-2100 entitled “Surface Mount Mounting Pad
Dimensions and Considerations” for further
details on this subject.
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
13
S
TANTALUM MnO
2
COMPONENT PERFORMANCE CHARACTERISTICS
(con’t.)
Tensile Force
Four Pounds (1.8 kilograms), 60 Seconds
4 lb. (1.8 Kg)
Post Test Performance:
a. Capacitance — within ±5% of initial value
b. DC Leakage — within initial limit
c. Dissipation Factor — within initial limit
APPLICATIONS
32. Handling
Automatic handling of encapsulated components
is enhanced by the molded case which provides
compatibility with all types of high speed pick and
place equipment. Manual handling of these
devices presents no unique problems. Care
should be taken with your fingers, however, to
avoid touching the solder-coated terminations as
body oils, acids and salts will degrade the sol-
derability of these terminations. Finger cots
should be used whenever manually handling all
solderable surfaces.
33. Termination Coating
KEMET's standard termination finish is 100% Sn
(Excluding the T492/3 series. Refer to specific
lead frame options available on T493 Series).
Standard terminations can be ordered with a "T"
suffix in the lead material designator of the
KEMET part number. Components ordered with
the "T" suffix are Pb-Free/RoHS compliant and
are backward and forward compatible with SnPb
Figure 12
R/2012-12
A/3216-18, S/3216-12
B/3528-21, T/3528-12
C/6032-28, U/6032-15
D/7343-31, V/7343-20, X/7343-43
E/7260-38
Table 10 – Land Pattern Dimensions for Wave Solder
3.90
4.70
5.00
7.60
8.90
8.90
0.80
0.80
1.10
2.50
3.80
3.80
1.80
1.50
2.50
2.50
2.70
4.40
1.55
1.95
1.95
2.55
2.55
2.55
2.35
2.75
3.05
5.05
6.35
6.35
KEMET/EIA Size Code
Z
G
X
Y
(ref)
C
(ref)
Table 9 – Land Pattern Dimensions for Reflow Solder
R/2012-12
A/3216-18, S/3216-12
B/3528-21, T/3528-12
C/6032-28, U/6032-15
D/7343-31, V/7343-20, X/7343-43
E/7260-38
4.30
5.10
5.40
8.00
9.70
9.70
0.80
0.80
1.10
2.50
3.80
3.80
1.26
1.10
1.80
1.80
2.70
4.40
1.75
2.15
2.15
2.75
2.95
2.95
2.55
2.95
3.25
5.25
6.75
6.75
KEMET/EIA Size Code
Z
G
X
Y
(ref)
C
(ref)
Pad Dimensions - mm
Pad Dimensions - mm
相關(guān)PDF資料
PDF描述
T491C225K035AG Surface Mount Capacitors
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