hbwhelp@micrel.com or (408) 955-1690 Absolute Maxim" />
參數(shù)資料
型號(hào): SY89871UMG
廠商: Micrel Inc
文件頁(yè)數(shù): 6/11頁(yè)
文件大?。?/td> 0K
描述: IC CLOCK BUFF DIVIDER 1:3 16-MLF
標(biāo)準(zhǔn)包裝: 100
系列: Precision Edge®
類(lèi)型: 扇出緩沖器(分配),除法器
電路數(shù): 1
比率 - 輸入:輸出: 1:3
差分 - 輸入:輸出: 是/是
輸入: CML,HSTL,LVDS,LVPECL
輸出: LVPECL
頻率 - 最大: 2.5GHz
電源電壓: 2.375 V ~ 3.63 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤(pán),16-MLF?
供應(yīng)商設(shè)備封裝: 16-MLF?(3x3)
包裝: 管件
產(chǎn)品目錄頁(yè)面: 1084 (CN2011-ZH PDF)
其它名稱(chēng): 576-1435
Micrel, Inc.
SY89871U
Oct. 1, 2013
4
M9999-010512-F
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) .................................... –0.5V to +4.0V
Input Voltage (VIN) .................................. –0.5V to VCC+0.3V
PECL Output Current (IOUT)
Continuous............................................................50mA
Surge ..................................................................100mA
VT Current (IVT) ........................................................100mA
Input Current IN, /IN (IIN) ...........................................50mA
RREF-AC Sink/Source Current (IVREF-AC).........................2mA
Lead Temperature (soldering, 20 sec.) ...................... 260°C
Storage Temperature (TS)........................... –65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC).............................. +2.375V to +3.63V
Ambient Temperature (TA) .......................... –40°C to +85°C
Package Thermal Resistance
(3)
QFN (
JA)
Still-Air ............................................................60°C/W
500lfpm ...........................................................54°C/W
QFN (
JB)
Junction-to-board...........................................38°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
2.37
3.60
V
ICC
Power Supply Current
No load, max VCC.
50
75
mA
RIN
Differential Input Resistance, (IN-to-/IN)
90
100
110
Ω
VIH
Input HIGH Voltage, (IN-to-/IN)
0.1
VCC+0.3
V
VIL
Input LOW Voltage, (IN-to-/IN)
–0.3
VIH–0.1
V
VIN
Input Voltage Swing
Note 5
0.1
VCC
V
VDIFF_IN
Differential Input Voltage Swing
Notes 5, 6
0.2
V
|IIN|
Input Current, (IN-to-/IN)
Note 7
45
mA
VREF_AC
Reference Voltage
VCC–1.525
VCC–1.425
VCC–1.325
V
Notes:
1.
Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” sections are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Junction-to-
board resistance assumes exposed pad is soldered (or equivalent) to the device’s most Negative potential on the PCB.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. See “Timing Diagram” for VIN definition. VIN (max.) is specified when VT is floating.
6. See “Typical Operating Characteristics” section for VDIFF definition.
7. Due to the internal termination (see “Input Buffer Structure” section) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not
apply a combination of voltages that causes the input current to exceed the maximum limit.
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