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參數(shù)資料
型號: SY88703VKC
廠商: Micrel Inc
文件頁數(shù): 4/8頁
文件大?。?/td> 0K
描述: IC AMP POST PECL 3.3V/5V 10-MSOP
標(biāo)準(zhǔn)包裝: 100
類型: 限幅后置放大器
應(yīng)用: 光纖學(xué)網(wǎng)絡(luò)
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 10-MSOP
包裝: 管件
Micrel, Inc.
SY89858U
Oct. 1, 2013
M9999-082907-C
hbwhelp@micrel.com or (408) 955-1690
4
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ..........................–0.5V to +4.0V
Input Voltage (VIN) ..................................–0.5V to VCC
Termination Current
Source or sink current on VT .................. ±100mA
Reference Current
(3)
Source or sink current on VREF-AC............ ±1.5mA
LVPECL Output Current (IOUT)
Continuous ................................................. 50mA
Surge........................................................ 100mA
Lead Temperature (soldering, 20 sec.) ..........+260°C
Storage Temperature (Ts)..................–65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC).................. +2.375V to +2.625V
......................................................+3.0V to +3.6V
Ambient Temperature (TA)................ –40°C to +85°C
Package Thermal Resistance
(4)
QFN (
JA)
Still-Air ..................................................... 35°C/W
QFN (
JB)
Junction-to-Board .................................... 20°C/W
DC Electrical Characteristics
(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
3.0
3.3
3.6
V
ICC
Power Supply Current
No load, max. VCC
95
150
mA
RIN
Input Resistance
(IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage
(IN, /IN)
Note 6
VCC –1.6
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
V
VT_IN
IN-to-VT
(IN, /IN)
1.28
V
VREF-AC
Output Reference Voltage
VCC–1.3V
VCC–1.2V
VCC–1.1V
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability use for input of the same package only.
4. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
JA and
JB values are determined for a 4-layer board in still air, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIH (min) not lower than 1.2V.
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