參數(shù)資料
型號: SY58626L
廠商: Micrel Semiconductor,Inc.
英文描述: DC-to-6.4Gbps Backplane Transmit Buffer with Selectable Output Pre-emphasis, I/O DCOffset Control, and 200mV-3.0VPP Output Swing
中文描述: DC至到6.4Gbps背板發(fā)送緩沖器的可選輸出預(yù)加重的I / O DCOffset控制和200mV的,3.0VPP輸出擺幅
文件頁數(shù): 7/18頁
文件大?。?/td> 830K
代理商: SY58626L
Micrel, Inc.
Absolute Maximum Ratings
(1)
SY58626L
March 2006
7
M9999-030206-B
hbwhelp@micrel.com
or (408) 955-1690
Supply Voltage (V
CC
)...............................................-0.5V to +4.0V
Input Voltage (V
IN
)...................................................... -0.5V to V
CC
Input Current (TXIN, /TXIN,
120mins)................................ 67mA
CML Output Current (I
OUT
)
Continuous (
120mins)..................................................... 67mA
Surge.............................................................................. 100mA
Termination Current
V
T
.................................................................................. ±100mA
V
REF-AC
Current
Source/sink current on V
REF-AC
.......................................... ±2mA
Source/sink current on V
REF-CTRL
....................................... ±2mA
Lead Temperature (soldering, 20 sec.) ..............................+260°C
Storage Temperature (T
S
)..................................... -65°C to 150
°
C
DC Electrical Characteristics
(4)
T
A
= 0°C to +70°C; unless otherwise stated.
Operating Ratings
(2)
Supply Voltage (V
CC
) .................................... +3.0V to +3.6V
Ambient Temperature (T
A
)...............................0°C to +70°C
Package Thermal Resistance
MLF (
θ
JA
)
Still-Air...............................................................34°C/W
MLF (
Ψ
JB
)
Junction-to-Board ..............................................20°C/W
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
I
EE
Power Supply
3.0
3.3
3.6
V
Power Supply Current
Max V
CC,
includes 50
internal
source resistors, 1.5V
PK
output
swing, no external load current
290
370
mA
R
IN
Input Resistance
(TXIN-to-VTTIN)
45
50
55
R
DIFF_IN
Differential Input Resistance
(TXIN-to-/TXIN)
90
100
110
V
IH
Input High Voltage
(TXIN, /TXIN)
V
EE
+1.5
V
CC
V
V
IL
Input LOW Voltage
(TXIN, /TXIN)
V
EE
+0.7
V
IH
-0.1
V
V
IN
Input Voltage Swing
(TXIN, /TXIN)
See Figure 4a.
0.1
1.5
V
PK
V
DIFF_IN
Differential Input Voltage Swing
|TXIN-/TXIN|
See Figure 4b.
0.2
V
PP
V
TTIN
TXIN-to-VTTIN
(TXIN, /TXIN)
1. 28
V
V
TTIN
Range
VTTIN Voltage Range
Voltage applied to VTTIN pin
V
EE
+1.7
V
CC
+0.1
V
V
TTOUT
Range
VTTOUT Voltage Range
Voltage applied to VTTOUT pin
V
CC
-1.5
V
CC
+1.5
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θ
JA
and
Ψ
JB
values are determined for a 4-layer board in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 500lfpm
Airflow. T
J
< 125
°
C.
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