Absolute Maximum Ratings (1)
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  • 參數(shù)資料
    型號(hào): SY58051UMG TR
    廠商: Micrel Inc
    文件頁(yè)數(shù): 6/10頁(yè)
    文件大?。?/td> 0K
    描述: IC GATE CML UNIV I/O TERM 16-MLF
    標(biāo)準(zhǔn)包裝: 1,000
    系列: SY55
    邏輯類型: 可配置多功能
    電路數(shù): 1
    輸入數(shù): 2
    施密特觸發(fā)器輸入: 無(wú)
    輸出類型: 差分
    電源電壓: 2.3 V ~ 3.6 V
    工作溫度: -40°C ~ 85°C
    安裝類型: 表面貼裝
    封裝/外殼: 16-VFQFN 裸露焊盤(pán),16-MLF?
    供應(yīng)商設(shè)備封裝: 16-MLF?(3x3)
    包裝: 帶卷 (TR)
    其它名稱: SY58051UMGTR
    SY58051UMGTR-ND
    Micrel, Inc.
    SY58051U-A
    July 2011
    5
    M9999-071311U-A
    hbwhelp@micrel.com
    Absolute Maximum Ratings (1)
    Supply Voltage (VCC).......................................0.5 to +4.0V
    Input Voltage (VIN).............................................-0.5V to VCC
    CML Output Voltage (VOUT)......... VCC to -1.0V to VCC +0.5V
    Termination Current
    (3)
    Source or Sink Current on VTA
    , V
    TB
    , V
    TS ................±60mA
    Input Current
    Source or Sink Current on A, /A, B, /B, S, /S .........±30mA
    Lead Temperature (soldering, 20 sec.).................... +260°C
    Storage Temperature (TS.).........................-65°C to +150°C
    Operating Ratings (2)
    Supply Voltage (VCC)....................... +2.375V to +2.625V
    or +3.0°C to +85°C
    Ambient Temperature (TA)..................... 40°C to +85°C
    Package Thermal Resistance
    (4)
    PDIP (
    θJA)
    Still-Air.................................................... 61°C/W
    QFN (ψJB)............................................................ 38°C/W
    DC Electrical Characteristics (5)
    TA = —40°C to +85°C, unless otherwise noted.
    or (408) 955-1690
    Notes:
    1.
    Permanent device damage may occur if the ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and
    functional operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute
    maximum ratings conditions for extended periods may affect device reliability.
    2.
    The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
    3.
    Due to the limited drive capability use for input of the same package only.
    4.
    Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. ΨJB uses 4-layer
    θJA n still-air, unless otherwise stated.
    5.
    The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
    6.
    Due to the internal termination (see Figure 1a) the input current depends on the applied voltages at A, /A and VTA inputs, the B, /B and VTB inputs or
    the S, /S and VTS inputs. Do not apply a combination of voltages that causes the input current to exceed the maximum limit.
    Symbol
    Parameter
    Condition
    Min.
    Typ.
    Max.
    Units
    VCC
    Power Supply
    VCC = 2.5V.
    VCC = 3.3V.
    2.375
    3.0
    2.5
    3.3
    2.625
    3.6
    V
    ICC
    Power Supply Current
    No Load, max.
    VCC.
    55
    70
    mA
    RDIFF_IN
    Differential Input Resistance
    (A-to/A, B-to-/B or S-to/S)
    80
    100
    120
    RIN
    Input Resistance
    (A-to-VTA, B-to-VTB or S-to-VTS)
    40
    50
    60
    VIH
    Input HIGH Voltage
    (A, /A or B, /B or S, /S)
    Note 6
    1.2
    VCC
    V
    VIL
    Input LOW Voltage
    (A, /A or B, /B or S, /S)
    Note 6
    0
    VIH-0.1
    mV
    VIN
    Input Voltage Swing
    (A, /A or B, /B or S, /S)
    Note 6
    See Figure 2a.
    100
    mV
    VDIFF_IN
    Differential Input Voltage Swing
    A-, /A or B-, /B or S-, /S
    Note 6
    See Figure 2b.
    200
    mV
    IN
    Input Current
    (A, /A or B, /B or S, /S)
    Note 6
    21
    mA
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