4
Precision Edge
SY58038U
Micrel
Absolute Maximum Ratings(1)
Power Supply Voltage (VCC ) ....................... –0.5V to +4.0V
Input Voltage (VIN) .......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ............................................................ 50mA
Surge ................................................................... 100mA
Termination Current(3)
Source or sink current on VT pin ....................... ±100mA
Lead Temperature (soldering, 10 sec.) .................... 265°C
Storage Temperature Range (TS ) .......... –65°C to +150°C
Operating Ratings(2)
Power Supply Voltage (VCC) ................ +2.375V to +2.625V
............................................................ +3.0V to +3.6V
Ambient Temperature Range (TA) ..............–40°C to +85°C
Package Thermal Resistance(4)
QFN (
θJA)
Still-Air ............................................................ 24°C/W
QFN (
ψJB)
Junction-to-board ............................................ 12°C/W
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
VCC = 2.5V.
2.375
2.5
2.625
V
VCC = 3.3V.
3.0
3.3
3.6
V
ICC
Power Supply Current
No load, max. VCC.
120
170
mA
RIN
Input Resistance (IN-to-VT)
40
50
60
ohms
RDIFF_IN
Differential Input Resistance
80
100
120
ohms
(IN-to-/IN)
VIH
Input HIGH Voltage
Note 6
VCC–1.6
VCC
V
(IN-to-/IN)
VIL
Input LOW Voltage
(IN-to-/IN)
0VIH–0.1
V
VIN
Input Voltage Swing
(IN-to-/IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
See Figure 1b.
0.2
V
(IN-to-/IN)
VT_IN
IN-to-VT (IN-to-/IN)
1.28
V
VREF-AC
Output Reference Voltage
VCC–1.3 VCC–1.2 VCC–1.1
V
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.
ΨJB uses 4-layer
θJA in still-air number unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIH (min), not lower than 1.2V.
DC ELECTRICAL CHARACTERISTICS(5)
TA= –40°C to +85°C, unless otherwise stated.