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參數(shù)資料
| 型號(hào)： | SX4BA-168S-1.27DSA |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 1.27mm Pitch 8Byte DIMM Socket |
| 中文描述： | 1.27mm間距8Byte DIMM插槽 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 144K |
| 代理商： | SX4BA-168S-1.27DSA |
D16
I
Operating Instruction
G
168 Contacts
[Procedures for Board Insertion]
1. Adjust DIMM to the socket key direction.
2. Insert the DIMM along both socket sides and straight in the vertical direction to the mounting board. At this time, anti-
vibration mechanism (protrusion) causes slight resistance to occur, but insert the DIMM until to hit the bottom. However,
avoid slant and flap insertion, or slant engagement or half-insertion.
3. When the DIMM is inserted, it is engaged with a click tone.
[Procedures for Board Extraction]
1. Press the ejector in the vertical direction.
2. Pick up the DIMM with fingers, which floats slightly.
Precautions
0
1. The ejector has strength enough to endure. However, if force is applied according to other operation methods instead of the
Procedures for Handling Sockets, products could be damaged.
0
2. This product is designed in compliance with JEDEC "8 Byte DIMM". However, if other boards are used instead of the
recommended module board or if the mounting devices are used the other than memory IC, troubles due to vibration or other
failures could occur. Confirm individual conditions.
0
3. Acute angles at pad edges of recommended module boards could cause failure in contacts. Therefore, it is recommended to
offset the tie-bar (0.1mm) from the center line, set the internal pad, or remove sharp edges or burrs according to the
recommended size ranges.
0
4. Stand-off is provided for measures to prevent flux rise, but resin sealing is not done. Confirm individual conditions.
0
5. If strong heat is concentrated on the product (reflow, etc.), the product will be deformed due to strength. Check individual
conditions.
0
6. Use alcohol-based flux solvent, which does not subject chemical reaction.
0
7. Don't provide convex or concave portions at external edges of the module board, or and chamfer areas at both edges. Comply
with the recommended sizes.
0
8. The dip section tip is considered for safety, the tip is slimmed for enhancement of mountability. Be careful for handling products.
0
9. If the board is installed under other conditions, instead of conditions indicated in the connector mounting board and installation
size pattern corresponding to individual products, failure could be caused. Observe the connector mounting board and
installation size pattern, corresponding to individual products.
10. Note that slant or flap insertion could cause product damage.
11. Slant engagement or half-insertion could cause circuit short or fuming.
12. If force is given regardless the "Procedures for Handling Sockets", it will cause breakage.
13. Dusts inclusion in connector engagement areas will cause failure in the product. In addition, it is recommended to install SX4-
1684S-DC (use a special cover. For details, consult HRS Sales Department) in the connector, which is not equipped with the
module.
14. Even if the ejector is separated from the hinge connection area, operativity of the DIMM injector is not affected. However, don't
forcibly remove the ejector lever. Such a behavior could cause the ejector lever to loosen.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SX4EA-168S-1.27DSA(92) | 功能描述:DDR3 / DDR2 / DDR 連接器 DDR3/DDR2/DDR CONN RoHS:否 制造商:Molex 產(chǎn)品類型:DIMM 系列:78588 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:240 安裝風(fēng)格:Through Hole 安裝角:Vertical 外殼材料:Thermoplastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:29 V 電流額定值:1 A 長(zhǎng)度: |
| SX4EA-168S-1.27DSD(92) | 功能描述:DDR3 / DDR2 / DDR 連接器 DDR3/DDR2/DDR CONN RoHS:否 制造商:Molex 產(chǎn)品類型:DIMM 系列:78588 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:240 安裝風(fēng)格:Through Hole 安裝角:Vertical 外殼材料:Thermoplastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:29 V 電流額定值:1 A 長(zhǎng)度: |
| SX4EA-168S-1.27DSD(94) | 功能描述:DDR3 / DDR2 / DDR 連接器 RoHS:否 制造商:Molex 產(chǎn)品類型:DIMM 系列:78588 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:240 安裝風(fēng)格:Through Hole 安裝角:Vertical 外殼材料:Thermoplastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:29 V 電流額定值:1 A 長(zhǎng)度: |
| SX4EA-168S-1.27DSD(95) | 功能描述:DDR3 / DDR2 / DDR 連接器 DDR3/DDR2/DDR CONN RoHS:否 制造商:Molex 產(chǎn)品類型:DIMM 系列:78588 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:240 安裝風(fēng)格:Through Hole 安裝角:Vertical 外殼材料:Thermoplastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:29 V 電流額定值:1 A 長(zhǎng)度: |
| SX4EEDW-168S-1.27DSK(90) | 功能描述:DDR3 / DDR2 / DDR 連接器 DDR3/DDR2/DDR CONN RoHS:否 制造商:Molex 產(chǎn)品類型:DIMM 系列:78588 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:240 安裝風(fēng)格:Through Hole 安裝角:Vertical 外殼材料:Thermoplastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:29 V 電流額定值:1 A 長(zhǎng)度: |
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