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參數(shù)資料
| 型號： | SX1BA-72S-0.635SH |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 0.635mm Pitch S.O. DIMM Socket |
| 中文描述： | 0.635毫米間距蘇DIMM插槽 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 217K |
| 代理商： | SX1BA-72S-0.635SH |
D34
I
Low Profile Type
B
Recommended Temperature Profile
G
IR Reflow: Recommended Temperature Profile (Up to second reflow)
G
Manual Soldering
Soldering iron temperature: 300
±
10
Manual soldering time: 3 seconds max.
This temperature profile is recommended.
The temperature may be slightly changed according to solder
paste types and amount.
G
Applicable Conditions
Reflow system : IR reflow
Solder
: Paste type 63 Sn/37 Pb
(Flux content 11 wt%)
Test board Glass epoxy 110mm x 85mm x 1.6 mm
Metal mask thickness: 0.15 mm
Recommended temperature profile.
The temperature may be slightly changed according to the solder paste type and amount.
5 seconds max.
Preheating time,
80 seconds
Soldering time,
30 seconds
Naturally
exposed
(Time)
250
240
220
200
180
150
140
T
()
CL No.
530-0006-0
530-0007-2
Number of Contacts
Part Number
SX1E-72S-0.635SH
SX1EA-72S-0.635SH
Note 2: The 3.3V and 5V keys correspond to the Small Outline DIMM key.
Remarks
Key
D
3.1
5.4
72
Selective gold plating
3.3V Type
5V Type
Selective gold plating
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SX1E-72S-0.635SH | 0.635mm Pitch S.O. DIMM Socket |
| SX1EA-72S-0.635SH | 0.635mm Pitch S.O. DIMM Socket |
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