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參數(shù)資料
| 型號： | SVSP0J105M |
| 廠商： | NEC Corp. |
| 英文描述： | Surface mount resin molded, Ultra miniaturized chip |
| 中文描述： | 表面貼裝模壓，超微型芯片 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 124K |
| 代理商： | SVSP0J105M |
14
SVS SERIES
(2)
Reflow soldering
Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate:
(a) Pattern design (In accordance with IEC1182)
The above dimensions are recommended. Note that if the pattern is too big, the component may not be
mounted in place.
(b) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature …… 260C max.
Time : 10 seconds max.
Whenever possible, perform preheating (at 150C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak
temperature and time shown above are applicable when the capacitor is to be soldered in a soldering oven
or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal
temperature of the capacitor may rise beyond the surface temperature.
(3) Using soldering iron
When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron
is very difficult. However, it is recommended that the following temperature and time be observed to maintain
the reliability of the capacitor:
lron temperature
……
300C max.
Time
………………………
3 seconds max.
Iron power
……………
30 W max.
X
G
Z
Case
G max.
Z min.
X min.
P
0.5
2.6
1.2
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