參數(shù)資料
型號: SVSP0G155M
廠商: NEC Corp.
英文描述: Surface mount resin molded, Ultra miniaturized chip
中文描述: 表面貼裝模壓,超微型芯片
文件頁數(shù): 13/16頁
文件大小: 124K
代理商: SVSP0G155M
13
SVS SERIES
5. Mounting
(1) Direct soldering
Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering:
(a) Temporarily fixing resin
Because the SVS series solid tantalum capacitors are larger in size and subject to more force than the chip
multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum
capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board
may adversely affect the solderability.
(b) Pattern design
a
b
c
a
Case
a
b
c
P
2.2
1.4
0.7
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the
pattern is too small, the solderability may be degraded.
(e) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature ....... 260C max.
Time ....... 5 seconds max.
Whenever possible, perform preheating (at 150C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible.
(d) Component layout
If many types of chip components are mounted on a printed circuit board which is to be soldered by means
of jet soldering, solderability may not be uniform over the entire board depending on the layout and
density of the components on the board (also take into consideration generation of flux gas).
(e) Flux
Use resin-based flux. Do not use flux with strong acidity.
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