參數(shù)資料
型號(hào): SVSP0G105M
廠(chǎng)商: NEC Corp.
英文描述: Surface mount resin molded, Ultra miniaturized chip
中文描述: 表面貼裝模壓,超微型芯片
文件頁(yè)數(shù): 7/16頁(yè)
文件大?。?/td> 124K
代理商: SVSP0G105M
7
SVS SERIES
15
10
5
0
–5
–10
–15
0.08
0.06
0.04
0.02
0
T
δ
0.1
0.01
0.001
Initial
2.5 V/2.2 F
Final
L
μ
0.08
0.06
0.04
0.02
0
T
δ
0.1
0.01
0.001
Initial
6.3 V/1 F
Final
L
μ
15
10
5
0
–5
–10
–15
Resistance to soldering (immersing for 10 sec. at 260C)
(reference data)
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