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參數(shù)資料
| 型號： | SVHB21D105M |
| 廠商： | NEC Corp. |
| 英文描述： | SURFACE MOUNT RESIN MOLDED TANTALUM CHIP CAPACITORS HIGH RELIABILITY |
| 中文描述： | 表面貼裝模壓片式鉭電容器高可靠性 |
| 文件頁數(shù)： | 18/20頁 |
| 文件大?。?/td> | 104K |
| 代理商： | SVHB21D105M |
18
SV/H SERIES
6. Cleaning
Generally, several organic solvents are used for flux cleaning of an electronic component after soldering. Many
cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor cleaning, and
ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two or more may be used
in combination. The temperature of the organic solvent may vary from room temperature to several 10
°
C, depending
on the desired effect. If cleaning is carried out with emphasis placed only on cleaning effect, however, the marking
on the electronic component cleaned may be erased, the appearance of the component may be damaged, and in the
worst case, the component may be functionally damaged. It is therefore recommended that the R series solid tantalum
capacitor be cleaned under the following conditions:
[Recommended conditions of flux cleaning]
(1) Cleaning solvent ......... Chlorosen, isopropyl alcohol
(2) Cleaning method ......... Shower cleaning, rinse cleaning, vapor cleaning
(3) Cleaning time .............. 5 minutes max.
*Ultrasonic cleaning
This cleaning method is extremely effective for eliminating dust that has been generated as a result of mechanical
processes, but may pose a problem depending on the condition. As a result of an experiment conducted by NEC,
it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some ultrasonic cleaning
machines. The cause of this phenomenon is considered metal fatigue of the capacitor terminals that occurred due
to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output power of the ultrasonic cleaning
machine or shortening the cleaning time may be a possible solution. However, it is difficult to specify the safe cleaning
conditions because there are many factors involved such as the conversion efficiency of the ultrasonic oscillator,
transfer efficiency of the cleaning bath, difference in cleaning effect depending on the location in the cleaning bath,
the size and quantity of the printed circuit boards to be cleaned, and the securing states of the components on the
boards. It is therefore recommended that ultrasonic cleaning be avoided as much as possible.
If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the
cleaning. For further information, consult NEC.
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