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參數(shù)資料
| 型號(hào)： | SVFC1C106M |
| 廠商： | NEC Corp. |
| 英文描述： | Surface mount resin molded chip with Built-in fuse, Low blow-out current 2A |
| 中文描述： | 表面貼裝模壓內(nèi)置保險(xiǎn)絲芯片樹(shù)脂，低擊出電流2A |
| 文件頁(yè)數(shù)： | 13/16頁(yè) |
| 文件大?。?/td> | 142K |
| 代理商： | SVFC1C106M |
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SV/F SERIES
13
DATA SHEET EC0003EJ3V1DS00
5. Reverse voltage
Because the capacitors are polarized, reverse voltage should not be applied.
If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very
short time and should not exceed the following.
10% of DC rated voltage at 25C
5% of DC rated voltage at 85C
1% of DC rated voltage at 125C
6. Mounting
(1) Direct soldering
Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering:
(a) Temporarily fixing resin
Because the SV/F series solid tantalum capacitors are larger in size and subject to more force than the chip
multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum
capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board
may adversely affect the solderability.
(b) Pattern design
a
b
c
a
Case
a
b
c
B2
3.0
2.8
1.6
C
4.1
2.3
2.4
D2
5.4
2.9
2.4
D
5.2
2.9
3.7
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the
pattern is too small, the solderability may be degraded.
(c) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature
…
260
C max.
Time
………………………
5 seconds max.
Whenever possible, perform preheating (at 150
C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible.
(d) Component layout
If many types of chip components are mounted on a printed circuit board which is to be soldered by means
of jet soldering, solderability may not be uniform over the entire board depending on the layout and
density of the components on the board (also take into consideration generation of flux gas).
(e) Flux
Use resin-based flux. Do not use flux with strong acidity.
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