參數(shù)資料
型號(hào): STV8130AD
廠商: 意法半導(dǎo)體
英文描述: ADJUSTABLE AND +3.3 V DUAL VOLTAGE REGULATOR WITH DISABLE AND RESET FUNCTIONS
中文描述: 可調(diào)3.3伏雙電壓調(diào)節(jié)器禁用和復(fù)位功能
文件頁(yè)數(shù): 8/12頁(yè)
文件大?。?/td> 135K
代理商: STV8130AD
POWER DISSIPATION AND LAYOUT INDICATIONS
STV8130AD
8/12
5
POWER DISSIPATION AND LAYOUT INDICATIONS
The power is mainly dissipated by the two device buffers. It can be calculated by the equation:
P = (V
IN1
-V
OUT1
) x I
OUT1
+ (V
IN2
-V
OUT2
) x I
OUT2
The following table lists the different R
thJA
values of these packages with or without a heat sink and
the corresponding maximum power dissipation assuming:
G
Maximum Ambient Temperature = 70° C
G
Maximum Junction Temperature = 140° C
Device
Heat Sink
R
thJA
in °C/W
P
MAX
in W
STV8130A
#
No
50
1.4
Yes
20
3.5
STV8130D
#
No
56 to 40
1.25 to 1.75
Yes
32
2.2
Figure 7: Thermal Resistance (Junction-to-Ambient) of DIP16 Package without Heat Sink
Figure 8: Metal plate mounted near the STV8130D
#
for heat sinking
Copper area (cm2) (35 μm plus solder) Board is face-down
To optimize the thermal conductivity of the copper
layer and the exchanges with the air, the solder
must cover the maximum amount of this area.
60
R
°
40
50
10
12
0
55
45
2
4
8
6
Test Board with
“On Board” square heat sink area.
Top View
Bottom View
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