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參數(shù)資料
| 型號： | STR73XF |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | ARM7TDMI 32-bit MCU with Flash, 3x CAN, 4 UARTs, 20 timers, ADC, 12 comm. interfaces |
| 中文描述： | ARM7TDMI的32位微控制器的閃存，3倍的CAN，4個(gè)UART，20定時(shí)器，ADC和12通信設(shè)備。接口 |
| 文件頁數(shù)： | 49/53頁 |
| 文件大?。?/td> | 764K |
| 代理商： | STR73XF |
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STR73xF
Package characteristics
49/53
4.2
Thermal characteristics
The average chip-junction temperature, T
J
, in degrees Celsius, may be calculated using the
following equation:
T
J
= T
A
+ (P
D
x
Θ
JA
)
(1)
Where:
–
–
–
–
T
A
is the Ambient Temperature in °C,
Θ
JA
is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
P
D
is the sum of P
INT
and P
I/O
(P
D
= P
INT
+ P
I/O
),
P
INT
is the product of I
DD
and
V
DD
, expressed in Watt. This is the Chip Internal
Power,
P
I/O
represents the Power Dissipation on Input and Output Pins; User Determined.
Most of the time for the applications P
I/O
<
P
INT
and may be neglected. On the other hand,
P
I/O
may be significant if the device is configured to drive continuously external modules
and/or memories.
–
An approximate relationship between P
D
and T
J
(if P
I/O
is neglected) is given by:
P
D
= K / (T
J
+ 273°C)
Therefore (solving equations 1 and 2):
K = P
D
x (T
A
+ 273°C) +
Θ
JA
x P
D2
Where:
–
K is a constant for the particular part, which may be determined from equation (3)
by measuring P
D
(at equilibrium) for a known T
A.
Using this value of K, the values
of P
D
and T
J
may be obtained by solving equations (1) and (2) iteratively for any
value of T
A
(2)
(3)
Table 26.
Thermal Characteristics
Symbol
Description
Package
Value (typical)
Unit
Θ
JA
Thermal Resistance Junction-Ambient
LFBGA144
50
°C/W
TQFP144
40
TQFP100
40
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