
0
10
20
30
40
50
60
70
80
90
100
100
120
140
160
180
200
220
240
260
280
300
S(Cu) (mm )
Rth(j-a) (
°
C/W)
IF=1A
Fig. 9:
Thermal resistance junction to ambient
versus coppersurface(epoxy printed circuit board
FR4,copperthickness:35
μ
m).
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
VFM(V)
IFM(A)
Tj=100
°
C
Tj=25
°
C
Tj=150
°
C
Fig. 8-2:
Forward voltage drop versus forward
current(low level,maximumvalues).
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
1E-2
1E-1
1E+0
5E+0
VFM(V)
IFM(A)
Tj=100
°
C
Tj=25
°
C
Tj=150
°
C
Fig. 8-1:
Forward voltage drop versus forward
current(high level,maximumvalues).
STPS140Z
4/5