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參數(shù)資料
| 型號： | STPCI2HEYC |
| 廠商： | 意法半導體 |
| 英文描述： | X86 Core PC Compatible System-on-Chip for Terminals |
| 中文描述： | x86內(nèi)核PC兼容系統(tǒng)上的終端芯片 |
| 文件頁數(shù)： | 102/111頁 |
| 文件大?。?/td> | 1896K |
| 代理商： | STPCI2HEYC |
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DESIGN GUIDELINES
102/111
Issue 1.0 - July 24, 2002
To avoid solder wicking over to the via pads during
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad). This gives a
diameter of 33 mil for a 25 mil ground pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no
local board distortion is tolerated.
6.4.5.3. Heat dissipation
The thickness of the copper on PCB layers is
typically 34 μm for external layers and 17 μm for
internal
layers.
This
dissipation is not good; high board temperatures
are concentrated around the devices and these
fall quickly with increased distance.
means
that
thermal
Where possible, place a metal layer inside the
PCB; this improves dramatically the spread of
heat and hence the thermal dissipation of the
board.
The possibility of using the whole system box for
thermal dissipation is very useful in cases of high
internal
temperatures
temperatures. Bottom side of the PBGA should be
thermally connected to the metal chassis in order
to propagate the heat flow through the metal.
Thermally connecting also the top side will
improve furthermore the heat dissipation.
Figure
6-35
illustrates such an implementation.
and
low
outside
Figure 6-34. Optimum Layout for Central Ground Ball - top layer
Via to Ground layer
hole diameter = 14 mil
Pad for ground ball
diameter = 25 mil
connections = 10 mil
Clearance = 6mil
External diameter = 37 mil
Solder mask
diameter = 33 mil
Figure 6-35. Use of Metal Plate for Thermal Dissipation
Metal planes
Thermal conductor
Board
Die
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| STPC12 | X86 Core PC Compatible System-on-Chip for Terminals |
| STPC12HEYC | X86 Core PC Compatible System-on-Chip for Terminals |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| STPCI2HEYI | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCINDUSTRIAL | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor |
| STP-CN04 | 功能描述:烙鐵 Cartridge Conical 0.4mm (0.016in) RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
| STP-CN05 | 功能描述:烙鐵 Cartridge Conical 0.5mm (0.02in) RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
| STP-CN10 | 功能描述:烙鐵 Cartridge Conical 1mm (0.039in) RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
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