- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄381118 > STPCE1EEBC (意法半導(dǎo)體) X86 Core General Purpose PC Compatible System - on - Chip PDF資料下載
參數(shù)資料
| 型號： | STPCE1EEBC |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | X86 Core General Purpose PC Compatible System - on - Chip |
| 中文描述： | x86內(nèi)核兼容的通用計(jì)算機(jī)系統(tǒng)-關(guān)于-芯片 |
| 文件頁數(shù)： | 58/87頁 |
| 文件大?。?/td> | 1356K |
| 代理商： | STPCE1EEBC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁當(dāng)前第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁
MECHANICAL DATA
58/87
Release 1.3 - January 29, 2002
5.3. SOLDERING RECOMMENDATIONS
High quality, low defect soldering requires
identifying the
optimum temperature profile
for
reflowing the solder paste, therefore optimizing
the process. The heating and cooling rise rates
must be compatible with the solder paste and
components. A typical profile consists of a
preheat, dryout, reflow and cooling sections.
The most critical parameter in the
preheat
section
is to minimize the rate of temperature rise
to less than
2°
C / second, in order to minimize
thermal
shock
on
components.
the
semi-conductor
Dryout section
is used primarily to ensure that
the solder paste is fully dried before hitting reflow
temperatures.
Solder reflow is accomplished in the
reflow zone
,
where the solder paste is elevated to a
temperature greater than the melting point of the
solder. Melting temperature must be exceeded by
approximately 20
°
C to ensure quality reflow.
In reality the profile is not a line, but rather
a range
of temperatures
all solder joints must be
exposed. The total temperature deviation from
component thermal mismatch, oven loading and
oven uniformity must be within the band.
Figure 5-7. Reflow soldering temperature range
Temperature (
°
C )
Time ( s )
PREHEAT
DRYOUT
REFLOW
COOLING
240
0
250
200
150
100
50
0
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| STPCE1EEBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HEBC | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HEBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBC | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBI | X86 Core General Purpose PC Compatible System - on - Chip |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCE1EEBI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBC | 制造商:STMicroelectronics 功能描述:X86 GENERAL PURPOSE CONTROLLER - Bulk |
| STPCE1HDBI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| STPCE1HEBC | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。