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參數(shù)資料
| 型號(hào)： | STM961-15 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | RF Power Module Digital Cellular Applications(用于數(shù)字蜂巢無線基站的RF功率模塊) |
| 中文描述： | 射頻功率模塊數(shù)字蜂窩應(yīng)用（用于數(shù)字蜂巢無線基站的射頻功率模塊） |
| 文件頁(yè)數(shù)： | 5/6頁(yè) |
| 文件大?。?/td> | 91K |
| 代理商： | STM961-15 |
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The STM961-15 power module should never be
operated under any condition which exceeds the
Absolute Maximum Ratings presented on this
data sheet. Nor should the module be operated
continuously at any of the specified maximum rat-
ings. If the module is to be subjected to one or
more of the maximum rating conditions, care must
be taken to monitor other parameters which may
be affected.
DECOUPLING
Failure to properly decouple any of the voltage
supply pins will result in oscillations at certain op-
erating frequencies. Therefore, it is recommended
that these pins be bypassed as indicated in the
Module DC and Test Fixture Configuration draw-
ing of this data sheet.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that a
satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
should be flat to within
±
0.05mm (
±
0.002 inch).
The module should be mounted to the heatsink
using 3.5 mm (or 6-32) or equivalent screws tor-
qued to 5-6 kg-cm (4-6 in-lb).
The module leads should be attached to equip-
ment PC board using 180
°
C solder applied to the
leads with a properly grounded soldering iron tip,
not to exceed 195
°
C, applied a minimum of 2 mm
(0.080 inch) from the body of the module for a
duration not to exceed 15 seconds per lead. It is
imperative that no other portion of the module,
other than the leads, be subjected to tempera-
tures in excess of 100
°
C (maximum storage tem-
perature), for any period of time, as the plastic
moulded cover, internal components and sealing
adhesives may be adversely affected by such
conditions.
Due to the construction techniques and materials
used within the module, reflow soldering of the
flange heatsink or leads, is not recommended.
THERMAL CONSIDERATIONS
It will be necessary to provide a suitable heatsink
in order to maintain the module flange tempera-
ture at or below the maximum case operating
temperature. In a case where the module output
power will be limited to +42 dBm CW and design-
ing for the worst case efficiency of 32%, the
power dissipated by the module will be 33.6
watts. The heatsink must be designed such that
the thermal rise will be less than the difference
between the maximum operating case tempera-
ture of the module while dissipating 33.6 watts.
At Tcase = +85
°
C, V = 26V, Z
L
= 50 ohms and
P
OUT
= 42 dBm, maximum junction temperatures
for the individual transistors should be below the
following values: Q1 = 140
°
C, Q2 = 145
°
C, Q3 =
130
°
C.
STM961-15
5/6
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