參數(shù)資料
型號: STM915-14
廠商: 意法半導(dǎo)體
英文描述: RF Power Module GSM Mobile Applications(用于蜂巢無線系統(tǒng)的RF功率模塊)
中文描述: 射頻功率模塊的GSM移動應(yīng)用程序(用于蜂巢無線系統(tǒng)的射頻功率模塊)
文件頁數(shù): 5/6頁
文件大?。?/td> 75K
代理商: STM915-14
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The STM915-14 power module should never be
operated under any condition which exceeds the
Absolute Maximum Ratings presented on this
data sheet. Nor should the module be operated
continuously at any of the specified maximum rat-
ings. If the module is to be operated under any
condition such that it may be subjected to one or
more of the maximum rating conditions, care
must be taken to monitor other parameters which
may be affected. For example, a combination of
high V
S3
and input overdrive could result in ex-
ceeding the maximum output power rating; in this
condition, the output power must be maintained
below the maximum rating by use of the gain
control pin.
GAIN CONTROL
The module output power should be limited to 20
watts (43 dBm). The module is designed to be
operated with V
S1
and V
S3
set to 8.0 Vdc, V
S2
and V
S4
set to 12.5 Vdc and input power set to
1.0 mW (0 dBm). Module gain is adjusted by
varying V
CONTROL
.
DECOUPLING
The bypassing internal to the module is sufficient
for the frequency range 90-1300 MHz. Care
should be taken to insure proper decoupling for
each application as the module is capable of a
wide range of operating characteristics including
”linear” operation, in which an important design
criteria is the use of appropriate bypassing. For
bypassing low frequencies while maintaining the
electrical specifications contained in this data
sheet, use of the decoupling network shown in
the ”Module DC and Test Fixture Configuration”
diagram herein is recommended.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that a
satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
should be flat to within
±
0.05 mm (
±
0.002 inch).
The module should be mounted to the heatsink
using 3 mm (or 4-40) or equivalent screws tor-
qued to 5-6 kg-cm (4-6 in-lb).
The module leads are attached to the equipment
PC board using 180
°
C solder applied to the leads
with it properly grounded soldering iron trip, not to
exceed 195
°
C, applied a minimum of 2 mm
(0.080 inch) from the body of the module for a
duration not to exceed 15 seconds per lead. It is
imperative that no other portion of the module,
other than the leads, be subjected to tempera-
tures in excess of 100
°
C (maximum storage tem-
perature), for any period of time, as the plastic
moulded cover, internal components and sealing
adhesives may be adversely affected by such
conditions.
Due to the construction techniques and the mate-
rials used within the module, reflow soldering of
the flange heatsink or leads, is not recommended.
THERMAL CONSIDERATIONS
It will be necessary to provide a suitable heatsink
in order to maintain the module flange tempera-
ture at or below the maximum case operating
temperature. In a case where the module output
power will be limited to +41.5 dBm (14 W) and
designing for the worst case efficiency of 35%,
the power dissipated by the module will be 26
watts. The heatsink must be designed such that
the thermal rise will be less than the difference
between the maximum ambient temperature at
which the module will operate and the maximum
operating case temperature of the module while
dissipating 26 watts.
STM915-14
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