Package characteristics
STM32F101x6, STM32F101x8, STM32F101xB
1.
Drawing is not to scale.
2.
The back-side pad is not internally connected to the VSS or VDD power pads.
3.
There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
also be soldered to the PCB.
Figure 31.
VFQFPN36 6 x 6 mm, 0.5 mm pitch,
package outline(1)
Figure 32.
Recommended footprint
(dimensions in mm)(1)(2)(3)
Seating plane
ddd
C
A3
A1
A
A2
D
e
28
36
Pin # 1 ID
R = 0.20
27
1
E
9
L
10
18
D2
19
b
E2
ZR_ME
0.75
0.30
6.30
0.50
1.00
4.30
4.80
4.10
4.30
36
1
27
10
9
18
19
ai14870
Table 47.
VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.800
0.900
1.000
0.0315
0.0354
0.0394
A1
0.020
0.050
0.0008
0.0020
A2
0.650
1.000
0.0256
0.0394
A3
0.250
0.0098
b
0.180
0.230
0.300
0.0071
0.0091
0.0118
D
5.875
6.000
6.125
0.2313
0.2362
0.2411
D2
1.750
3.700
4.250
0.0689
0.1457
0.1673
E
5.875
6.000
6.125
0.2313
0.2362
0.2411
E2
1.750
3.700
4.250
0.0689
0.1457
0.1673
e
0.450
0.500
0.550
0.0177
0.0197
0.0217
L
0.350
0.550
0.750
0.0138
0.0217
0.0295
ddd
0.080
0.0031
1.
Values in inches are converted from mm and rounded to 4 decimal digits.
